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Applied Physics Letters

Volumn 92, Issue 26, 2008, Pages

Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column

(5) Xu, Luhua a Han, Jung Kyu a Liang, Jarrett Jun a Tu, K N a Lai, Yi Shao b

a UNIVERSITY OF CALIFORNIA (United States)

b ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COLUMNS (STRUCTURAL); COPPER; COPPER ALLOYS; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; METALLIZING; SOLDERED JOINTS; WELDING;

(1 1 0) SURFACE; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; COMPOUND FORMATION; CURRENT CROWDING; FLIP CHIP SOLDER JOINTS; FLIP CHIPPING; SIDE WALLS; SN-AG-CU SOLDER; TWO TYPES; VOID FORMATIONS;

BRAZING;

EID: 46649118288 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.2953692 Document Type: Article

Times cited : (51)

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