Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2116-2125

  Xu, Luhua ^a   Pang, John H L ^a   Ren, Fei ^b   Tu, K N ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Electromigration; Intermetallic compound; Lead free SnAgCu solder; Nanoindentation

Indexed keywords

LEAD-FREE SNAGCU SOLDER; NANOINDENTATION; PACKAGING ASSEMBLIES;

CURRENT DENSITY; ELASTIC MODULI; ELECTROMIGRATION; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; HARDNESS; INDENTATION; SOLDERED JOINTS; TIN ALLOYS;

INTERMETALLICS;

EID: 33846411442     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0321-8     Document Type: Conference Paper

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