Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure

Applied Physics Letters

Volumn 91, Issue 13, 2007, Pages

  Chang, Y W ^a   Chiang, T H ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTROMIGRATION; FLIP CHIP DEVICES; SURFACE STRUCTURE;

BUMP RESISTANCE; KELVIN STRUCTURE; VOID PROPAGATION;

SOLDERED JOINTS;

EID: 34848822771     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2790376     Document Type: Article

References (12)

1. K. N. Tu, J. Appl. Phys. 94, 5451 (2003).
2. A. T. Huang, A. M. Gusak, K. N. Tu, and Y.-S. Lai, Appl. Phys. Lett. 88, 141911 (2006).
3. S. L. Wright, R. Polastre, H. Gan, L. P. Buchwalter, R. Horton, P. S. Andry, E. Sprogis, C. Patel, C. Tsang, J. Knickerbocker, J. R. Lloyd, A. Sharma, and M. S. Sri-Jayantha, Proceeding of Electronic Components and Technology Conference, IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, 2006 (unpublished).
4. Y. W. Chang, S. W. Liang, and C. Chen, Appl. Phys. Lett. 89, 032103 (2006).
5. S. W. Liang, Y. W. Chang, T. L. Shao, C. Chen, and K. N. Tu, Appl. Phys. Lett. 89, 022117 (2006).
6. S. N. Gee, N. Kelkar, J. Huang, and K. N. Tu, Proceedings of IPACK 2005 ASME InterPACK, San Francisco, CA, USA, (unpublished).
7. S. W. Liang, Y. W. Chang, and C. Chen, J. Electron. Mater. 35, 1647 (2006).
8. E. C. C. Yeh, W. J. Choi, and K. N. Tu, Appl. Phys. Lett. 80, 580 (2002).
9. L. Zhang, S. Ou, J. Huang, K. N. Tu, S. Gee, and L. Nguyen, Appl. Phys. Lett. 88, 012106 (2006).
10. S. H. Chiu and C. Chen, Appl. Phys. Lett. 89, 262106 (2006).
11. S. W. Liang, S. H. Chiu, and C. Chen, Appl. Phys. Lett. 90, 082103 (2007).
12. C. K. Chou, C. A. Chen, S. W. Liang, and C. Chen, J. Appl. Phys. 99, 054502 (2006).