|
Volumn 93, Issue 4, 2008, Pages
|
The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ALUMINUM;
BRAZING;
COPPER;
CURRENT DENSITY;
ELECTROMIGRATION;
LEAD;
METAL RECOVERY;
METALLIZING;
WELDING;
CHEMICAL-DISSOLUTION;
CURRENT STRESSING;
FLIP CHIPPING;
LEAD-FREE SOLDER;
LINEAR RELATIONSHIPS;
RESISTANCE CHANGES;
SOLDER INTERCONNECTS;
TIME-DEPENDENT;
VOID GROWTH;
DISSOLUTION;
|
EID: 49149121094
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2963473 Document Type: Article |
Times cited : (23)
|
References (11)
|