High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

Acta Materialia

Volumn 54, Issue 3, 2006, Pages 613-621

  Alam, M O ^a   Wu, B Y ^a   Chan, Y C ^a   Tu, K N ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

BGA; Electromigration; Heat dissipation; Joule heating; Solder joint

Indexed keywords

ANODES; COPPER; DISSOLUTION; ELECTROMIGRATION; GROWTH (MATERIALS); HEAT LOSSES; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; SOLDERED JOINTS;

BGA; INTERMETALLIC COMPOUND (IMC); JOULE HEATING; UNDER BUMP METALLIZATION (UBM);

CURRENT DENSITY;

EID: 29844448941     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.09.031     Document Type: Article

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