Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Journal of Materials Research

Volumn 22, Issue 11, 2007, Pages 3265-3272

  Lee, A ^a   Ho, C E ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SOLDERED JOINTS; SUBSTRATES;

CURRENT STRESSING; MICROSTRUCTURAL COARSENING; SURFACE UNDULATIONS;

TIN ALLOYS;

EID: 36549061094     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0413     Document Type: Article

References (16)

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