Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 9, 2013, Pages 3149-3169

  Sona, Mrunali ^a   Prabhu, K N ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC ASSEMBLIES; INTER-METALLIC COMPOUNDS; LEAD-FREE SOLDER JOINT; MECHANICAL INTEGRITY; MICRO-STRUCTURE EVOLUTIONS; MICROSTRUCTURAL PHASIS; RELIABILITY PROBLEMS; SOLDER JOINT RELIABILITY;

MECHANISMS; MICROSTRUCTURE; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84882644638     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-013-1240-0     Document Type: Review

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