Optimization of Pb-Free solder joint reliability from a metallurgical perspective

Journal of Electronic Materials

Volumn 41, Issue 2, 2012, Pages 253-261

  Zeng, Kejun ^a   Pierce, Mike ^a   Miyazaki, Hiroshi ^b   Holdford, Becky ^a  

^a TEXAS INSTRUMENTS   (United States)

^b Texas Instruments Japan Ltd   (Japan)

Author keywords

electronic packaging; interfacial reaction; Pb free solder; Reliability; solder joint; soldering

Indexed keywords

BALL GRID ARRAY PACKAGES; DISSOLVED METALS; ELECTRONIC PACKAGING; HIGH RATE; HIGH STIFFNESS; IMC STRUCTURE; INTERFACIAL CRACKING; MECHANICAL TESTS; PB FREE SOLDERS; PB-FREE; SNAGCU SOLDER; SOLDER ALLOYS; SOLDER COMPOSITION; SOLDER JOINTS; SURFACE MATERIALS; UNDER BUMP METALLIZATION;

ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; PACKAGING; RELIABILITY; SOLDERING; SURFACE CHEMISTRY; TIN;

SOLDERING ALLOYS;

EID: 84855465074     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1732-8     Document Type: Review

References (48)

1. T. Costlow, EE Times, Jan. 24 (2000)
2. W. Peng, Licentiate Thesis, Helsinki University of technology, Helsinki, Finland (2001)
3. ME Loomans ME Fine 2000 Metall. Mater. Trans. 31A 4 1155 10.1007/s11661-000-0111-5 1:CAS:528:DC%2BD3cXivFyku7k%3D
4. K-W Moon WJ Boettinger UR Kattner FS Biancaniello CA Handwerker 2000 J. Electron. Mater. 29 10 1122 10.1007/s11664-000-0003-x 1:CAS:528: DC%2BD3cXnsFOqsbw%3D
5. D Lewis S Allen M Notis A Scotch 2002 J. Electron. Mater. 31 2 161 10.1007/s11664-002-0163-y 1:CAS:528:DC%2BD38XhsFCntLc%3D
6. P. Oberndorff, PhD Thesis, Eindhoven University of Technology, Eindhoven, The Netherland (2001).
7. K Zeng KN Tu 2002 Mater. Sci. Eng. R 38 2 55 10.1016/S0927-796X(02)00007- 4
8. KS Kim SH Huh K Suganuma 2003 J. Alloys Compd. 352 1-2 226 10.1016/S0925-8388(02)01166-0 1:CAS:528:DC%2BD3sXitlert7g%3D
9. C. Zhang, J.-K. Lin, and L. Li, Proceedings of the 51st Electronic Components and Technology Conference, May 29-June 31, 2001, Orlando, FL, USA, IEEE, pp. 457-464.
10. K Suganuma SH Huh K Kim H Nakase Y Nakamura 2001 Mater. Trans. 42 2 286 10.2320/matertrans.42.286 1:CAS:528:DC%2BD3MXis1ehtL4%3D
11. M. Amagai, Y. Toyoda, and T. Tajima, Proceedings of the 53rd Electronic Components and Technology Conference, May 27-30, 2003, New Orleans, USA, IEEE, pp. 317-322.
12. JG Lee KN Subramanian 2007 Microelectron. Reliab. 47 1 118 10.1016/j.microrel.2006.02.001 1:CAS:528:DC%2BD28Xhtlahsr%2FF (Pubitemid 44909197)
13. M Kerr N Chawla 2004 Acta Mater. 52 4527 10.1016/j.actamat.2004.06.010 1:CAS:528:DC%2BD2cXms1CntL4%3D
14. A. Lal and E. Bradley, Proceedings of the 56th Electronic Components and Technology Conference, May 30-June 2, 2006, San Diego, CA, USA, IEEE, pp. 1628-1633.
15. D. Kim, D. Suh, T. Millard, H. Kim, C. Kumar, M. Zhu, and Y. Xu, Proceedings of the 57th Electronic Components and Technology Conference, May 29-June 1, 2007, Reno, Nevada, USA, IEEE, pp. 1614-1619.
16. H. Kim, M. Zhang, C.M. Kumar, D. Suh, P. Liu, D. Kim, M. Xie, and Z. Wang, Proceedings of the 57th Electronic Components and Technology Conference, May 29-June 1, 2007, Reno, Nevada, USA, IEEE, pp. 962-967.
17. P.-W. Kim, B.-S. Kim, E.-C. Ahn, and T.-G. Chung, Proceedings of the 8th Electronics Packaging Technology Conference, Dec. 6-8, 2006, Singapore, IEEE, pp. 168-173.
18. YS Lai PF Yang CL Yeh 2006 Microelectron. Reliab. 46 2-4 645 10.1016/j.microrel.2005.07.005 1:CAS:528:DC%2BD28XlvV2ksA%3D%3D (Pubitemid 43106966)
19. Y.-S. Lai, P.-F. Yang, C.-L. Yeh, and C.-I. Tsai, Proceeding of the 6th International Conference on Electronics Materials and Packaging, Dec. 5-7, 2004, Penang, Malaysia, IEEE, pp. 56-60.
20. A. Syed, T.S. Kim, Y.M. Cho, C.W. Kim, and M. Yoo, Proceedings of the 8th Electronics Packaging Technology Conference, Dec. 6-8, 2006, Singapore, IEEE, pp. 404-411.
21. D. Cavasin, Proceeding of the 56th Electronic Components and Technology Conference, May 30-June 2, 2006, San Diego, CA, USA, IEEE, pp. 1191-1195.
22. P.-L. Eu, M. Ding, H.-J. Hoh, J. Rayos, P. Su, W. Lindsay, and S. Chopin, Proceedings of the 57th Electronic Components and Technology Conference, May 29-June 1, 2007, Reno, Nevada, USA, IEEE, pp. 1819-1824.
23. X.J. Zhao, J.F.J.M. Caers, J.W.C.d. Vries, E.H. Wong, and R. Rajoo, Proceedings of the 57th Electronic Components and Technology Conference, May 29-June 1, 2007, Reno, Nevada, USA, IEEE, pp. 1522-1529.
24. KJ Zeng V Vuorinen JK Kivilahti 2002 IEEE. Trans. Electron. Packag. Manuf. 25 3 162 10.1109/TEPM.2002.801648 1:CAS:528:DC%2BD3sXhtVWit7Y%3D
25. WT Chen CE Ho CR Kao 2002 J. Mater. Res. 17 2 263 10.1557/JMR.2002.0036 1:CAS:528:DC%2BD38Xjt1amu70%3D
26. C.E. Ho, Y.W. Lin, S.C. Yang, and C.R. Kao, Proceedings of the 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, March 16-18, Irvine, CA, USA, IEEE, pp. 39-44.
27. CE Ho YW Lin SC Yang CR Kao DS Jiang 2006 J. Electron. Mater. 35 5 1017 10.1007/BF02692562 1:CAS:528:DC%2BD28XlsVOisbc%3D
28. C.E. Ho, W.C. Luo, S.C. Yang, and C.R. Kao, Proceedings of the IMAPS Taiwan 2005 International Technical Symposium, June 2005, Taipei, pp. 98-102.
29. CE Ho RY Tsai YL Lin CR Kao 2002 J. Electron. Mater. 31 6 584 10.1007/s11664-002-0129-0 1:CAS:528:DC%2BD38XkslajsL0%3D
30. WC Luo CE Ho JY Tsai YL Lin CR Kao 2005 Mater. Sci. Eng. A 396 1-2 385
31. J-W Yoon S-B Jung 2005 J. Alloys Compd. 396 122 10.1016/j.jallcom.2004. 12.009 1:CAS:528:DC%2BD2MXks1KksLY%3D (Pubitemid 40684256)
32. DQ Yu CML Wu DP He N Zhao L Wang JKL Lai 2005 J. Mater. Res. 20 8 2205 10.1557/JMR.2005.0275 1:CAS:528:DC%2BD2MXosVehtbk%3D (Pubitemid 41763324)
33. S-W Chen C-H Wang 2006 J. Mater. Res. 21 9 2270 10.1557/jmr.2006.0298 1:CAS:528:DC%2BD28Xpsl2gsrg%3D (Pubitemid 44946047)
34. JY Kim YC Sohn Y Jin 2007 J. Mater. Res. 22 3 770 10.1557/jmr.2007.0085 1:CAS:528:DC%2BD2sXks1OjtLw%3D (Pubitemid 46421269)
35. HK Kim KN Tu 1996 Phys. Rev. B Condens. Matter Mater. Phys. 53 23 16027 10.1103/PhysRevB.53.16027 1:CAS:528:DyaK28XjvVeqsr8%3D
36. CH Lin SW Chen CH Wang 2002 J. Electron. Mater. 31 9 907 10.1007/s11664-002-0182-8 1:CAS:528:DC%2BD38XntFOktLs%3D
37. CE Ho WT Chen CR Kao 2001 J. Electron. Mater. 30 4 379 10.1007/s11664-001-0047-6 1:CAS:528:DC%2BD3MXivValurc%3D
38. A. Syed, T. Kim, and S.-W. Cha, Proceedings of the SMTA International, Oct. 7-11, 2007, Orlando, FL, SMTA, pp. 390-396.
39. L Garner S Sane D Suh T Byrne A Dani T Martin M Mello M Patel R Williams 2005 Intel Technol. J. 9 4 297
40. K. Zeng, Proceedings of the 6th Topical Research Conference on Reliability, Oct. 27-28, 2003, Austin, TX, USA, SEMATECH, http://ismi.sematech. org/meetings/archives/reliability/20031027/.
41. SJ Wang CY Liu 2003 J. Electron. Mater. 32 11 1303 10.1007/s11664-003- 0027-0 1:CAS:528:DC%2BD3sXpslSmtLw%3D
42. TL Shao TS Chen YM Huang C Chen 2004 J. Mater. Res. 19 12 3654 10.1557/JMR.2004.0478 1:CAS:528:DC%2BD2cXhtVOlsLjP (Pubitemid 40168207)
43. CM Tsai WC Luo CW Chang YC Shieh CR Kao 2004 J. Electron. Mater. 33 12 1424 10.1007/s11664-004-0082-1 1:CAS:528:DC%2BD2MXhsVGg
44. CW Chang SC Yang CT Tu CR Kao 2007 J. Electron. Mater. 36 11 1455 10.1007/s11664-007-0235-0 1:CAS:528:DC%2BD2sXht1Cku73L (Pubitemid 47561758)
45. KK Hong JB Ryu CY Park JY Huh 2008 J. Electron. Mater. 37 1 61 10.1007/s11664-007-0283-5 1:CAS:528:DC%2BD1cXmtV2isA%3D%3D (Pubitemid 350276010)
46. S Yee L Chen J Zeng 2004 SMTA J. 17 2 29
47. EH Wong R Rajoo SKW Seah CS Selvanayagam WDv Driel JFJM Caers XJ Zhao N Owens LC Tan M Leoni PL Eu Y-S Lai C-L Yeh 2008 Microelectron. Reliab. 48 7 1069 10.1016/j.microrel.2008.04.008 1:CAS:528:DC%2BD1cXpt1KgsrY%3D
48. W.H. Zhu, L. Xu, J.H. Pang, X.R. Zhang, E. Poh, Y.F. Sun, A.Y.S. Sun, C.K. Wang, and H.B. Tan, Proceedings of the 58th Electronic Components and Technology Conference, May 27-30, 2008, Lake Buena Vista, FL, USA, IEEE, pp. 1667-1672.