Effect of iron and indium on IMC formation and mechanical properties of lead-free solder

Materials Science and Engineering: A

Volumn 553, Issue , 2012, Pages 22-31

  Fallahi, H ^a   Nurulakmal, M S ^a   Arezodar, A Fallahi ^b   Abdullah, Jamaluddin ^c  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b AMIRKABIR UNIVERSITY OF TECHNOLOGY   (Iran)

^c SCHOOL OF PHYSICS   (Malaysia)

Author keywords

Ball shear test; Intermetallic compound; Lead free solders; Shear strength; Wettability

Indexed keywords

CERIUM; COPPER ALLOYS; EUTECTICS; INDIUM; INTERMETALLICS; IRON; LEAD-FREE SOLDERS; SHEAR FLOW; SILVER ALLOYS; TERNARY ALLOYS; THERMAL EXPANSION; TIN ALLOYS;

BALL-SHEAR TEST; COATED SUBSTRATES; ELECTROLESS NI-P; ENVIRONMENTAL CONCERNS; EUTECTIC SOLDERS; INTERMETALLICS COMPOUNDS; LEAD SOLDERS; SHEARS STRENGTH; SN-AG-CU; SNAGCU SOLDER;

WETTING;

EID: 84863783503     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.05.086     Document Type: Article

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