Nanoindentation of rare earth-Sn intermetallics in Pb-free solders

Intermetallics

Volumn 18, Issue 5, 2010, Pages 1016-1020

  Dudek, M A ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

A. Rare earth intermetallics; B. Mechanical properties at ambient temperature; F. Mechanical testing

Indexed keywords

B. MECHANICAL PROPERTIES AT AMBIENT TEMPERATURE; CONSTITUENT PHASIS; CONTINUOUS STIFFNESS METHODS; DEFORMATION BEHAVIOR; INTERMETALLIC COMPOUNDS; LIMITED DATA; MECHANICAL PROPERTIES AT AMBIENT TEMPERATURE; PB FREE SOLDERS; PURE SN; RARE EARTH INTERMETALLICS; SEM; SN-AG-CU; YOUNG'S MODULUS;

ELASTIC MODULI; ELASTICITY; HARDNESS; INTERMETALLICS; LEAD; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; MECHANICAL TESTING; NANOINDENTATION; RARE EARTHS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING ALLOYS; TEMPERATURE;

TIN;

EID: 77950020933     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2010.01.028     Document Type: Article

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