Effect of carbon nanotubes on the shear Strength and electrical resistivity of a lead-free solder

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 515-522

  Nai, S M L ^a   Wei, J ^b   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Carbon nanotubes; Composites; Electrical resistivity; Lead free solder; Shear strength

Indexed keywords

ELECTRIC CONDUCTIVITY; LEAD; SHEAR STRENGTH; SOLDERING; SYNTHESIS (CHEMICAL);

BULK COMPOSITE SOLDERS; LEAD FREE SOLDER;

CARBON NANOTUBES;

EID: 39849098570     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0379-6     Document Type: Article

References (43)

1. 1. D.C. Lin, G.X. Wang, T.S. Srivatsan, M. Al-Hajri, and M. Petraroli, Mater. Lett. 57(21), 3193 (2003).
2. 2. J.L. Marshall J. Calderon J. Sees G. Lucey J.S. Hwang 1991 IEEE Trans. Compon. Hybrids Manuf. Technol. 14 4 698 10.1109/33.105119 1:CAS:528:DyaK38XmsVOgsQ%3D%3D J.L. Marshall, J. Calderon, J. Sees, G. Lucey, J.S. Hwang, IEEE Trans. Compon. Hybrids Manuf. Technol. 14(4), 698 (1991).
3. 3. H. Mavoori S. Jin 2000 JOM 52 6 30 10.1007/s11837-000-0145-6 1:CAS:528:DC%2BD3cXksFWmtrk%3D H. Mavoori, S. Jin, JOM 52(6), 30 (2000).
4. 4. L. Wang, D.Q. Yu, S.Q. Han, H.T. Ma, and H.P. Xie, International Conference on the Business of Electronic Product Reliability and Liability 50 (2004).
5. 5. S.M.L. Nai J. Wei M. Gupta 2006 J. Electron. Mater. 35 7 1518 10.1007/s11664-006-0142-9 1:CAS:528:DC%2BD28XnslCmsrs%3D S.M.L. Nai, J. Wei, M. Gupta, J. Electron. Mater. 35(7), 1518 (2006).
6. 6. S.M.L. Nai, J. Wei, and M. Gupta, Proceedings of ASME IMECE 2006, International Mechanical Engineering Congress and Exposition, Chicago, Illinois, USA (November 2006).
7. 7. S.M.L. Nai J. Wei M. Gupta 2006 Thin Solid Films 504 1–2 401 10.1016/j.tsf.2005.09.057 1:CAS:528:DC%2BD28Xit1ejt7o%3D S.M.L. Nai, J. Wei, M. Gupta, Thin Solid Films 504(1–2), 401 (2006).
8. 8. S.M.L. Nai J. Wei M. Gupta 2006 Solid State Phenomena 111 59 1:CAS:528:DC%2BD28Xjt1Smsr4%3D 10.4028/www.scientific.net/SSP.111.59 S.M.L. Nai, J. Wei, M. Gupta, Solid State Phenomena 111, 59 (2006).
9. 9. S.M.L. Nai, J. Wei, and M. Gupta, Electronic and Photonic Packaging, Integration and Packaging of Micro/Nano/Electronic Systems, Proceedings of ASME IMECE, Orlando, Florida, USA, 295 (2005).
10. 10. S. Iijima 1991 Nature 354 56 10.1038/354056a0 1:CAS:528:DyaK38Xmt1Ojtg%3D%3D S. Iijima, Nature 354, 56 (1991).
11. 11. M.F. Yu B.S. Files S. Arepalli R.S. Ruoff 2000 Phys. Rev. Lett. 84 5552 10.1103/PhysRevLett.84.5552 1:CAS:528:DC%2BD3cXjvVyisrc%3D M.F. Yu, B.S. Files, S. Arepalli, R.S. Ruoff, Phys. Rev. Lett. 84, 5552 (2000).
12. 12. H. Dai 2002 Surf. Sci. 500 218 10.1016/S0039-6028(01)01558-8 1:CAS:528:DC%2BD38XhslyqtLo%3D H. Dai, Surf. Sci. 500, 218 (2002).
13. 13. K.T. Lau D. Hui 2002 Compos. Part B: Eng. 33 263 10.1016/S1359-8368(02)00012-4 K.T. Lau, D. Hui, Compos. Part B: Eng. 33, 263 (2002).
14. 14. R.B. Pipes P. Hubert 2002 Compos. Sci. Technol. 62 419 10.1016/S0266-3538(02)00002-7 1:CAS:528:DC%2BD38XhtFGru7o%3D R.B. Pipes, P. Hubert, Compos. Sci. Technol. 62, 419 (2002).
15. 15. J.S. Delmotee A. Rubio 2002 Carbon 40 1729 10.1016/S0008-6223(02)00012-X J.S. Delmotee, A. Rubio, Carbon 40, 1729 (2002).
16. 16. L. Valentini J. Biagiotti J.M. Kenny S. Santucci 2003 Compos. Sci. Technol. 63 1149 10.1016/S0266-3538(03)00036-8 1:CAS:528:DC%2BD3sXivV2ktb8%3D L. Valentini, J. Biagiotti, J.M. Kenny, S. Santucci, Compos. Sci. Technol. 63, 1149 (2003).
17. 17. C. Balazsi Z. Shen Z. Konya Z. Kasztovszky F. Weber Z. Vertesy L.P. Biro I. Kiricsi P. Arato 2005 Compos. Sci. Technol. 65 5 727 10.1016/j.compscitech.2004.10.006 1:CAS:528:DC%2BD2MXnsVOltw%3D%3D C. Balazsi, Z. Shen, Z. Konya, Z. Kasztovszky, F. Weber, Z. Vertesy, L.P. Biro, I. Kiricsi, P. Arato, Compos. Sci. Technol. 65(5), 727 (2005).
18. 18. A.A. Mamedov N.A. Kotov M. Prato D.M. Guldi J.P. Wicksted A. Hirsch 2002 Nat. Mater. 1 190 10.1038/nmat747 1:CAS:528:DC%2BD38XptV2qtr4%3D A.A. Mamedov, N.A. Kotov, M. Prato, D.M. Guldi, J.P. Wicksted, A. Hirsch, Nat. Mater. 1, 190 (2002).
19. 19. S.I. Cha K.T. Kim S.N. Arshad C.B. Mo S.H. Hong 2005 Adv. Mater. 17 1377 10.1002/adma.200401933 1:CAS:528:DC%2BD2MXlsVWhs78%3D S.I. Cha, K.T. Kim, S.N. Arshad, C.B. Mo, S.H. Hong, Adv. Mater. 17, 1377 (2005).
20. 20. M. Braunovic and D. Gagnon, Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts 20–23, 267 (2004).
21. 21. K.D. Kim D.D.L. Chung 2002 J. Electron. Mater. 31 9 933 10.1007/s11664-002-0186-4 1:CAS:528:DC%2BD38XntFOktLc%3D K.D. Kim, D.D.L. Chung, J. Electron. Mater. 31(9), 933 (2002).
22. 22. F. Guo J.G. Lee T. Hogan K.N. Subramanian 2005 J. Mater. Res. 20 2 364 10.1557/JMR.2005.0064 1:CAS:528:DC%2BD2MXht1aisbk%3D F. Guo, J.G. Lee, T. Hogan, K.N. Subramanian, J. Mater. Res. 20(2), 364 (2005).
23. 23. P.E. Gise and R. Blanchard, Semiconductor and Integrated Circuit Fabrication Techniques (Reston Pub. Co., 1979).
24. 24. J.S. Hwang 1996 Modern Solder Technology for Competitive Electronics Manufacturing McGraw-Hill New York J.S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing. (New York: McGraw-Hill, 1996).
25. 25. S.Y. Chang C.F. Chen S.J. Lin T.Z. Kattamis 2003 Acta Mater. 51 6291 10.1016/S1359-6454(03)00462-2 1:CAS:528:DC%2BD3sXptFGlurc%3D S.Y. Chang, C.F. Chen, S.J. Lin, T.Z. Kattamis, Acta Mater. 51, 6291 (2003).
26. 26. L. Weber C. Fischer A. Mortensen 2003 Acta Mater. 51 495 10.1016/S1359-6454(02)00432-9 1:CAS:528:DC%2BD3sXit1ant78%3D L. Weber, C. Fischer, A. Mortensen, Acta Mater. 51, 495 (2003).
27. 27. L. Weber 2005 Acta Mater. 53 1945 1:CAS:528:DC%2BD2MXhslKgu78%3D L. Weber, Acta Mater. 53, 1945 (2005).
28. 28. V.C. Srivastava A. Schneider V. Uhlenwinkel K. Bauckhage 2004 J. Mater. Sci. 39 6821 10.1023/B:JMSC.0000045611.25373.20 1:CAS:528:DC%2BD2cXovVCmtrc%3D V.C. Srivastava, A. Schneider, V. Uhlenwinkel, K. Bauckhage, J. Mater. Sci. 39, 6821 (2004).
29. 29. M. Gupta G. Karunasiri M.O. Lai 1996 Mater. Sci. Eng. A 219 133 10.1016/S0921-5093(96)10416-0 M. Gupta, G. Karunasiri, M.O. Lai, Mater. Sci. Eng. A 219, 133 (1996).
30. 30. W.D. Callister 1994 Materials Science and Engineering: An Introduction Wiley Singapore W.D. Callister, Materials Science and Engineering: An Introduction (Singapore: Wiley, 1994).
31. 31. R.J. Arsenault N. Shi 1986 Mater. Sci. Eng. 81 1–2 175 1:CAS:528:DyaL28XlsFOitbg%3D R.J. Arsenault, N. Shi, Mater. Sci. Eng. 81(1–2), 175 (1986).
32. 32. A.H. Cottrell 1964 The Mechanical Properties of Matter Wiley New␣York A.H. Cottrell, The Mechanical Properties of Matter (New York: Wiley, 1964).
33. 33. J.H.L. Pang, B.S. Xiong, C.C. Neo, X.R. Zhang, and T.H. Low, Electronic Components and Technology Conference 673 (2003).
34. 34. M. Kouzeli A. Mortensen 2002 Acta Mater. 50 39 10.1016/S1359-6454(01)00327-5 1:CAS:528:DC%2BD3MXptFensLg%3D M. Kouzeli, A. Mortensen, Acta Mater. 50, 39 (2002).
35. 35. T.W. Clyne 1995 An Introduction to Metal Matrix Composites Cambridge University Press Cambridge T.W. Clyne, An Introduction to Metal Matrix Composites (Cambridge: Cambridge University Press, 1995).
36. 36. V.C. Nardone K.M. Prewo 1986 Scripta Metall. 20 43 10.1016/0036-9748(86)90210-3 1:CAS:528:DyaL28XntlSmtQ%3D%3D V.C. Nardone, K.M. Prewo, Scripta Metall. 20, 43 (1986).
37. 37. Z. Zhang D.L. Chen 2006 Scripta Mater. 54 I321 10.1016/j.scriptamat.2005.09.051 1:CAS:528:DC%2BD2MXht1agsLfI Z. Zhang, D.L. Chen, Scripta Mater. 54, I321 (2006).
38. 38. R. George K.T. Kashyap R. Rahul S. Yamdagni 2005 Scripta Mater. 53 1159 10.1016/j.scriptamat.2005.07.022 1:CAS:528:DC%2BD2MXptVWlsr0%3D R. George, K.T. Kashyap, R. Rahul, S. Yamdagni, Scripta Mater. 53, 1159 (2005).
39. 39. C.S. Goh J. Wei L.C. Lee M. Gupta 2006 Nanotechnology 17 7 10.1088/0957-4484/17/1/002 1:CAS:528:DC%2BD28XitVSksbY%3D C.S. Goh, J. Wei, L.C. Lee, M. Gupta, Nanotechnology 17, 7 (2006).
40. 40. Y. Feng H.L. Yuan M. Zhang 2005 Mater. Charact. 55 211 10.1016/j.matchar.2005.05.003 1:CAS:528:DC%2BD2MXpsFyqur4%3D Y. Feng, H.L. Yuan, M. Zhang, Mater. Charact. 55, 211 (2005).
41. 41. A.J. Sunwoo J.W. Morris G.K. Lucey 1992 Metall. Trans. A 23 1323 10.1007/BF02665064 A.J. Sunwoo, J.W. Morris, G.K. Lucey, Metall. Trans. A 23, 1323 (1992).
42. 42. C.Y. Liu C. Chen A.K. Mai K.N. Tu 1999 J. Appl. Phys. 85 7 3882 10.1063/1.369779 1:CAS:528:DyaK1MXitVCrtrs%3D C.Y. Liu, C. Chen, A.K. Mai, K.N. Tu, J. App. Phys. 85(7), 3882 (1999).
43. 43. S.W. Chen S.H. Wu S.W. Lee 2003 J. Electron. Mater. 32 11 1188 10.1007/s11664-003-0010-9 S.W. Chen, S.H. Wu, S.W. Lee, J. Electron. Mater. 32(11), 1188 (2003).