Mechanical and microstructural properties of SnAgCu solder joints

Materials Science and Engineering: A

Volumn 420, Issue 1-2, 2006, Pages 55-62

  Sundelin, Janne J ^a   Nurmi, Sami T ^a   Lepistö, Toivo K ^a   Ristolainen, Eero O ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Aging; Lead free; Shear strength; SnAgCu; Solder

Indexed keywords

AGING OF MATERIALS; EUTECTICS; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRENGTH; TIN ALLOYS;

ISOTHERMAL AGING; LEAD-FREE SOLDER; SOLDER JOINTS;

SOLDERING ALLOYS;

AGING OF MATERIALS; EUTECTICS; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRENGTH; SOLDERING ALLOYS; TIN ALLOYS;

EID: 33645535327     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.01.065     Document Type: Article

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