Intermetallic growth and failure study for Sn-Ag-Cu/ENIG PBGA solder joints subject to thermal cycling

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 682-686

  Xu, Luhua ^a   Pang, John H L ^a   Che, F X ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ISOTHERMAL AGING; SOLDERED ASSEMBLY; TEMPERATURE CYCLING; THERMAL CYCLING AGING;

AGING OF MATERIALS; COPPER; GOLD; LEAD; NICKEL; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 24644518125     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. M.R. Harrison, J.H. Vincent and A.A.H. Steen. Soldering & Surf. Mount Technol, 13(3),21 (2001).
2. Edwin Bradley. IEEE Proceedings 2003 Electronic Components and Technology Conf., 41.
3. John H.L. Pang and Stephen C.K. Soldering & Surface Mount Technol 14(3) (2002) Special Issue on Lead-free and lead-bearing solders.
4. J. L. Marshall and S. R. Walter, Int. J. Hybrid Microelectron., 10, 1987, p11.
5. W. K. Choi, et al. "Interfacial Microstructure and Joint Strength of Sn-3.5Ag-X (X=Cu, In, Ni) Solder Joint", J. Mater. Res., 17, 2002, p43.
6. H. L. J. Pang, K. H. Tan, X. Q. Shi, and Z. P. Wang, Materials Science and Engineering A 307, 42 (2001).
7. P. T. Vianco, et al., "Intermetallic compound layer development during the solid state thermal aging of 63Sn3Pb solder/Au-Pt-Pd thick film couples", IEEE Trans. CPMT-A, 20, 1997, p478.
8. John H.L. Pang, and Luhua Xu Intermetallic Growth Studies on Sn-Ag-Cu Lead-Free Solder Joints. Journal of Electronic Materials, 2004, 33-10: 1219
9. John H.L. Pang, T.H. Low, B.S. Xiong, Luhua Xu, "Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength", Thin Solid Film, 462-463, (2004), 370-375.W. Zhou, H.L.J. Pang, and Z.P. Wang. T.
10. K.S. Kim, S.H. Huh, K. Suganuma. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints Journal of Alloys and Compounds 352 (2003) 226-236
11. Paul G. Harris Kaldev S. Chaggar. The role of intermetallic compounds in lead-free soldering Soldering & Surface Mount Technology 1998, 10(3): 38-52