Thermal and mechanical stability of Ce-containing Sn-3.9Ag-0.7Cu lead-free solder on Cu and electroless Ni-P metallizations

Journal of Electronic Materials

Volumn 41, Issue 12, 2012, Pages 3249-3258

  Xie, Huxiao ^a   Chawla, Nikhilesh ^a   Mirpuri, Kabir ^b  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Isothermal aging; Lead free solder; Monotonic shear; Rare earth

Indexed keywords

ELECTROLESS NI-P; INTERMETALLIC LAYER; ISOTHERMAL AGING; LAP SHEAR; LEAD FREE SOLDERS; METALLIZATIONS; MICROSTRUCTURE AND MECHANICAL PROPERTIES; MONOTONIC SHEAR; PHYSICAL AND MECHANICAL PROPERTIES; RE ELEMENTS; ROOM TEMPERATURE; SHEAR BEHAVIOR; SOLDER INTERFACES; SOLDER JOINTS;

MECHANICAL PROPERTIES; METALLIZING; MICROSTRUCTURE; PHASE STABILITY; RARE EARTHS; SEMICONDUCTING GALLIUM COMPOUNDS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 84869498483     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2170-y     Document Type: Article

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