Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

Materials and Design

Volumn 43, Issue , 2013, Pages 40-49

  El Daly, A A ^a   Hammad, A E ^a   Fawzy, A ^b   A Nasrallh, D ^a  

^a Zagazig University   (Egypt)

^b Ain Shams University   (Egypt)

Author keywords

Lead free solder; Mechanical properties; Microstructure; Non ferrous alloys; Sn Ag Cu alloys

Indexed keywords

CREEP BEHAVIORS; CREEP LIFE; CREEP PROPERTIES; DEFORMATION BEHAVIOR; DISLOCATION MOVEMENT; ELEVATED TEMPERATURE; EXTENDED VOLUME; LEAD FREE SOLDERS; MINOR ALLOYING; NI-DOPED; NONFERROUS ALLOY; PB FREE SOLDERS; PROEUTECTIC; SB-DOPED; SN-AG-CU ALLOY; SOLDER ALLOYS; SOLID SOLUTION HARDENING;

ALLOYING; ALLOYS; COPPER ALLOYS; CREEP; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 84864071853     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2012.06.058     Document Type: Article

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