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Journal of Alloys and Compounds

Volumn 490, Issue 1-2, 2010, Pages 508-514

Mechanical property and fracture behavior characterizations of 96.5 Sn-3.0 Ag-0.5 Cu solder joints

(3) Chang, Shou Yi a Huang, Yi Chung a Lin, Yu Mu a

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

Intermetallic compound; Mechanical property; Solder

Indexed keywords

A-THERMAL; CONSTITUENT PHASIS; EUTECTIC PHASE; FRACTURE BEHAVIOR; INTERFACE REACTIONS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; MECHANICAL RELIABILITY; MOLTEN SOLDERS; REFLOW TEMPERATURES; SN-3.0AG-0.5CU; SOLDER BALLS; SOLDER JOINTS; UNDERLAYERS; WETTING FORCE;

BRITTLE FRACTURE; BRITTLENESS; FRACTURE MECHANICS; MECHANICAL PROPERTIES; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; TIN;

SOLDERING ALLOYS;

EID: 74149090636 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2009.10.071 Document Type: Article

Times cited : (23)

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