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Volumn 39, Issue 13, 2004, Pages 4211-4217

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AGING OF MATERIALS; COPPER; DIFFUSION; GROWTH (MATERIALS); INTERFACES (MATERIALS); INTERMETALLICS; ISOTHERMS; SOLDERING ALLOYS; THERMAL EFFECTS;

EID: 3142722694     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000033401.38785.73     Document Type: Article
Times cited : (69)

References (24)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.