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Volumn 39, Issue 13, 2004, Pages 4211-4217
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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
AGING OF MATERIALS;
COPPER;
DIFFUSION;
GROWTH (MATERIALS);
INTERFACES (MATERIALS);
INTERMETALLICS;
ISOTHERMS;
SOLDERING ALLOYS;
THERMAL EFFECTS;
DIFFUSION-CONTROLLED KINETICS;
ISOTHERMAL AGING;
TEMPERATURE DEPENDENCE;
TIN ALLOYS;
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EID: 3142722694
PISSN: 00222461
EISSN: None
Source Type: Journal
DOI: 10.1023/B:JMSC.0000033401.38785.73 Document Type: Article |
Times cited : (69)
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References (24)
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