Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading

Journal of Alloys and Compounds

Volumn 486, Issue 1-2, 2009, Pages 242-245

  You, Taehoon ^a   Kim, Yunsung ^a   Jung, Woogwang ^a   Moon, Jeongtak ^b   Choe, Heeman ^a  

^a Kookmin University   (South Korea)

^b MK Electron Co Ltd   (South Korea)

Author keywords

Intermetallics; Mechanical properties; Sn Ag Cu; Solder joint; Surface finish; Surfaces and interfaces

Indexed keywords

AGING PROCESS; AGING TREATMENT; FAILURE MECHANISM; FRACTURE BEHAVIOR; FRACTURE FORCE; HIGH STRAIN RATES; HIGH-SPEED; SN-3.0AG-0.5CU; SN-AG-CU; SNAGCU SOLDER; SOLDER ALLOYS; SOLDER BUMP; SOLDER JOINT; SOLDER JOINTS; SURFACE FINISH; SURFACE FINISHES; SURFACES AND INTERFACES; TEST METHOD;

COPPER ALLOYS; FRACTURE; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; TIN ALLOYS;

TIN;

EID: 70350228791     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.07.085     Document Type: Article

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