Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1196-1203

  Song, Fubin ^a   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; INTERMETALLICS; SEMICONDUCTOR GROWTH; SHEAR DEFORMATION; TIN COMPOUNDS;

COLD BUMP PULL (CBP); ELECTROLESS NICKEL (ENIG); SOLDER BALL ATTACHMENT STRENGTH; THERMAL AGING;

SOLDERED JOINTS;

EID: 33845568589     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645804     Document Type: Conference Paper

References (13)

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