SCOPUS 정보 검색 플랫폼

Volumn 509, Issue 5, 2011, Pages 2326-2333

Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(1) Tsao, L C a

a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Ag3Sn; Cu6Sn5; Sn3.5Ag0.5Cu

Indexed keywords

ABSORPTION THEORY; AG3SN; CU SUBSTRATE; CU-SN INTERMETALLICS; CU6SN5; GRAIN SIZE; IMC LAYER; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; NANO-TIO; PARTICLE FORMATIONS; RIPENING PROCESS; SN3.5AG0.5CU; SOLDERING REACTIONS; SOLDERING TEMPERATURE; SURFACE ENERGIES; TIO;

ABSORPTION; INTERFACIAL ENERGY; INTERMETALLICS; MORPHOLOGY; NANOPARTICLES; PRISMS; SILVER; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN;

SOLDERING;

EID: 78651352045 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2010.11.010 Document Type: Article

Times cited : (98)

References (31)

1
- 33845694955
- I. Anderson J. Mater. Sci.: Mater. Electron. 18 2007 55 76
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 55-76
- Anderson, I.¹

2
- 51249164034
- J. Glazer J. Electron. Mater. 23 1994 693 700
- (1994) J. Electron. Mater. , vol.23 , pp. 693-700
- Glazer, J.¹

3
- 0037076832
- K. Zeng, and K.N. Tu Mater. Sci. Eng. (R) 38 2002 55 105
- (2002) Mater. Sci. Eng. (R) , vol.38 , pp. 55-105
- Zeng, K.¹ Tu, K.N.²

4
- 0037463944
- K.S. Kim, S.H. Huh, and K. Sugannuma J. Alloys Compd. 352 2003 226 236
- (2003) J. Alloys Compd. , vol.352 , pp. 226-236
- Kim, K.S.¹ Huh, S.H.² Sugannuma, K.³

5
- 0141994512
- D.C. Lin, S. Liu, T.M. Guo, G.X. Wang, T.S. Srivatsan, and M. Petraroli Mater. Sci. Eng. A 360 2003 285 292
- (2003) Mater. Sci. Eng. A , vol.360 , pp. 285-292
- Lin, D.C.¹ Liu, S.² Guo, T.M.³ Wang, G.X.⁴ Srivatsan, T.S.⁵ Petraroli, M.⁶

6
- 0038347098
- D.C. Lin, G.X. Wang, T.S. Srivatsana, M. Al-Hajri, and M. Petraroli Mater. Lett. 57 2003 3193 3198
- (2003) Mater. Lett. , vol.57 , pp. 3193-3198
- Lin, D.C.¹ Wang, G.X.² Srivatsana, T.S.³ Al-Hajri, M.⁴ Petraroli, M.⁵

7
- 70350068088
- L.C. Tsao, and S.Y. Chuang Mater. Des. 31 2010 990 993
- (2010) Mater. Des. , vol.31 , pp. 990-993
- Tsao, L.C.¹ Chuang, S.Y.²

8
- 33748690770
- J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, and H.X. Gao J. Electron. Mater. 35 2006 1672 1679
- (2006) J. Electron. Mater. , vol.35 , pp. 1672-1679
- Shen, J.¹ Liu, Y.C.² Han, Y.J.³ Tian, Y.M.⁴ Gao, H.X.⁵

9
- 33749491985
- J. Shen, Y.C. Liu, Y.J. Han, D.J. Wang, H.X. Tian, and X. Gao J. Mater. Sci. Technol. 22 2006 529 532
- (2006) J. Mater. Sci. Technol. , vol.22 , pp. 529-532
- Shen, J.¹ Liu, Y.C.² Han, Y.J.³ Wang, D.J.⁴ Tian, H.X.⁵ Gao, X.⁶

10
- 42449127939
- P. Liu, P. Yao, and J. Liu J. Electron. Mater. 37 2008 874 879
- (2008) J. Electron. Mater. , vol.37 , pp. 874-879
- Liu, P.¹ Yao, P.² Liu, J.³

11
- 77956094965
- A.K. Gain, T. Fouzder, Y.C. Chan, A. Sharif, N.B. Wong, and W.K.C. Yung J. Alloys Compd. 506 2010 216 223
- (2010) J. Alloys Compd. , vol.506 , pp. 216-223
- Gain, A.K.¹ Fouzder, T.² Chan, Y.C.³ Sharif, A.⁴ Wong, N.B.⁵ Yung, W.K.C.⁶

12
- 67349281398
- P. Babaghorbani, S.M.L. Nai, and M. Gupta J. Alloys Compd. 478 2009 458 461
- (2009) J. Alloys Compd. , vol.478 , pp. 458-461
- Babaghorbani, P.¹ Nai, S.M.L.² Gupta, M.³

13
- 67349191469
- X. Wang, Y.C. Liu, C. Wei, H.X. Gao, P. Jiang, and L.M. Yu J. Alloys Compd. 480 2009 662 665
- (2009) J. Alloys Compd. , vol.480 , pp. 662-665
- Wang, X.¹ Liu, Y.C.² Wei, C.³ Gao, H.X.⁴ Jiang, P.⁵ Yu, L.M.⁶

14
- 37349121122
- K. Mohan Kumar, V. Kripesh, and A.A.O. Tay J. Alloys Compd. 450 2009 229 237
- (2009) J. Alloys Compd. , vol.450 , pp. 229-237
- Mohan Kumar, K.¹ Kripesh, V.² Tay, A.A.O.³

15
- 13444252734
- D.Q. Yu, L. Wang, C.M.L. Wu, and C.M.T. Law J. Alloys Compd. 389 2005 153 158
- (2005) J. Alloys Compd. , vol.389 , pp. 153-158
- Yu, D.Q.¹ Wang, L.² Wu, C.M.L.³ Law, C.M.T.⁴

16
- 76549124422
- X.Y. Liu, M.L. Huang, Y.H. Zhao, C.M.L. Wu, and L. Wan J. Alloys Compd. 492 2010 433 438
- (2010) J. Alloys Compd. , vol.492 , pp. 433-438
- Liu, X.Y.¹ Huang, M.L.² Zhao, Y.H.³ Wu, C.M.L.⁴ Wan, L.⁵

17
- 67349268917
- J. Shen, and Y.C. Chan J. Alloys Compd. 477 2009 552 559
- (2009) J. Alloys Compd. , vol.477 , pp. 552-559
- Shen, J.¹ Chan, Y.C.²

18
- 0000985936
- A.K. Larsson, L. Stenberg, and S. Lidin Z. Kristallogr. 210 1995 832 837
- (1995) Z. Kristallogr. , vol.210 , pp. 832-837
- Larsson, A.K.¹ Stenberg, L.² Lidin, S.³

19
- 41149101101
- N. Zhao, X.M. Pan, H.T. Ma, C. Dong, S.H. Guo, W. Lu, and L. Wang Phys.: Conf. Ser. 98 2008 012029
- (2008) Phys.: Conf. Ser. , vol.98 , pp. 012029
- Zhao, N.¹ Pan, X.M.² Ma, H.T.³ Dong, C.⁴ Guo, S.H.⁵ Lu, W.⁶ Wang, L.⁷

20
- 34547677920
- J.O. Suh, K.N. Tu, and N. Tamura Appl. Phys. Lett. 91 2007 051907
- (2007) Appl. Phys. Lett. , vol.91 , pp. 051907
- Suh, J.O.¹ Tu, K.N.² Tamura, N.³

21
- 44449117311
- H.F. Zou, H.J. Yang, and Z.F. Zhang Acta Mater. 56 2008 2649 2662
- (2008) Acta Mater. , vol.56 , pp. 2649-2662
- Zou, H.F.¹ Yang, H.J.² Zhang, Z.F.³

22
- 70449879593
- Y.P. Cui, and M.L. Huang 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009) 2009 593 596
- (2009) 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009) , pp. 593-596
- Cui, Y.P.¹ Huang, M.L.²

23
- 0001477244
- X.F. Bian, X.M. Pan, X.B. Qin, and M.H. Jiang Sci. China 45 2002 113 119
- (2002) Sci. China , vol.45 , pp. 113-119
- Bian, X.F.¹ Pan, X.M.² Qin, X.B.³ Jiang, M.H.⁴

24
- 20844459962
- M.L. Huang, T. Loeher, A. Ostmann, and H. Reichl Appl. Phys. Lett. 86 2005 181908
- (2005) Appl. Phys. Lett. , vol.86 , pp. 181908
- Huang, M.L.¹ Loeher, T.² Ostmann, A.³ Reichl, H.⁴

25
- 39149126674
- J.O. Suh, K.N. Tu, G.V. Lutsenko, and A.M. Gusak Acta Mater. 56 2008 1075 1083
- (2008) Acta Mater. , vol.56 , pp. 1075-1083
- Suh, J.O.¹ Tu, K.N.² Lutsenko, G.V.³ Gusak, A.M.⁴

26
- 33749074067
- Q.S. Zhu, Z.F. Zhang, J.K. Shang, and Z.G. Wang Mater. Sci. Eng. A 435-436 2006 588 594
- (2006) Mater. Sci. Eng. A , vol.435-436 , pp. 588-594
- Zhu, Q.S.¹ Zhang, Z.F.² Shang, J.K.³ Wang, Z.G.⁴

27
- 20344388336
- T. Lauril, V. Vuorinen, and J.K. Kivilahti Mater. Sci. Eng. R 49 2005 1
- (2005) Mater. Sci. Eng. R , vol.49 , pp. 1
- Lauril, T.¹ Vuorinen, V.² Kivilahti, J.K.³

28
- 77954141951
- L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, and C.H. Huang Mater. Des. 31 2010 4831 4835
- (2010) Mater. Des. , vol.31 , pp. 4831-4835
- Tsao, L.C.¹ Chang, S.Y.² Lee, C.I.³ Sun, W.H.⁴ Huang, C.H.⁵

29
- 80051546649
- doi: 10.1007/s10854-010-0253-1, in press
- T.H. Chuang, M.W. Wu, S.Y. Chang, C.C. Ping, L.C. Tsao, J. Mater. Sci.: Mater. Electron., (2010) doi: 10.1007/s10854-010-0253-1, in press.
- (2010) J. Mater. Sci.: Mater. Electron.
- Chuang, T.H.¹ Wu, M.W.² Chang, S.Y.³ Ping, C.C.⁴ Tsao, L.C.⁵

30
- 1642284116
- Metallurgy Industry Press Beijing
- Q.J. Zhai, S.K. Guan, and Q.Y. Shang Alloy Thermo-Mechanism: Theory and Application 1999 Metallurgy Industry Press Beijing pp. 156-160
- (1999) Alloy Thermo-Mechanism: Theory and Application
- Zhai, Q.J.¹ Guan, S.K.² Shang, Q.Y.³

31
- 67349138190
- J. Shen, and Y.C. Chen J. Alloys Compd. 477 2009 909 914
- (2009) J. Alloys Compd. , vol.477 , pp. 909-914
- Shen, J.¹ Chen, Y.C.²

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