The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2O 3 composite solder/Cu interface during soldering reaction

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 100-107

  Chang, S Y ^a   Tsao, L C ^b   Wu, M W ^c   Chen, C W ^d  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^d NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION OF AL; COMPOSITE SOLDERS; CU SUBSTRATE; DIFFUSION CONTROLLED; IMAGING SOFTWARE; IMC LAYER; INTERFACIAL INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; KINETIC EVOLUTION; KINETICS ANALYSIS; LIQUID-SOLID REACTION; PROCESSING CONDITION; SCALLOP-SHAPED; SEM MICROGRAPHS; SNAGCU SOLDER; SOLDERING REACTIONS;

ACTIVATION ENERGY; ALUMINUM; GROWTH KINETICS; INTERMETALLICS; KINETICS; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING; TIN; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 84856973568     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0476-9     Document Type: Article

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