Wetting behavior of solders

Journal of ASTM International

Volumn 7, Issue 5, 2010, Pages

  Kumar, Girish ^a   Prabhu, K Narayan ^b  

^a ST JOSEPH ENGINEERING COLLEGE   (India)

^b NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

IMC; Lead free solders; Microstructure; Wetting

Indexed keywords

BASE METALS; DRIVING FORCES; ELECTRONIC CIRCUITS; EXPERIMENTAL CONDITIONS; HEALTH CONCERNS; IMC; IMC LAYER; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; METAL INTERFACE; METALLURGICAL REACTION; OPTIMUM THICKNESS; REACTIVE SYSTEM; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SOLDER MATERIAL; SOLDER WETTING; SPREADING KINETICS; STRUCTURAL DEFECT; SUBSTRATE METALS; UNIFORM LAYER; WETTING BEHAVIOR;

CONTACT ANGLE; METALS; MICROSTRUCTURE; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; WETTING;

LEAD;

EID: 77953561778     PISSN: None     EISSN: 1546962X     Source Type: Journal    
DOI: 10.1520/JAI103055     Document Type: Article

References (60)

1. Suganuma, K., "Advances in Lead-Free Electronics Soldering," Curr. Opin. Solid State Mater. Sci., Vol. 5, 2001, pp. 55-64.
2. Vianco, P. T. and Frear, D. R., "Issues in the Replacement of Lead-Bearing Solders," JOM, Vol. 45, No. 7, 1993, pp. 14-19.
3. Wu, C. M. L., Yu, D. Q., Law, C. M. T., and Wang, L., "Properties of Lead-Free Solder Alloys with Rare Earth Element Additions," Mater. Sci. Eng. R., Vol. 44, 2004, pp. 1-44.
4. Abtew, M. and Selvaduray, G., "Lead-Free Solders in Micro Electronics," Mater. Sci. Eng. R., Vol. 27, 2000, pp. 95-141.
5. Kamal, M. and Gouda, E. S., "Enhancement of Solder Properties of Sn-9Zn Lead-Free Solder Alloy," Cryst. Res. Technol., Vol. 41, No. 12, 2006, pp. 1210-1213.
6. Suraski, D. and Seelig, K., "The Current Status of Lead-Free Solder Alloys," IEEE Trans. Electron. Packag. Manuf., Vol. 24-4, 2001, pp. 244-248.
7. Cheng, S. C. and Lin, K. L., "The Thermal Property of Lead-Free Sn-8.55Zn-1Ag-XAl Solder Alloys and Their Wetting Interaction with Cu," J. Electron. Mater., Vol. 31, No. 9, 2002, pp. 940-945.
8. Zhao, H., Nalagatla, D. R., and Sekulic, D. P., "Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface," J. Electron. Mater., Vol. 38, No. 2, 2009, pp. 284-291.
9. Sebo, P. and Stefanik, P., "Effect of In Addition on Sn-Ag Solder, Its Wetting and Shear Strength of Copper Joints," Kovove Mater., Vol. 43, 2005, pp. 202-209.
10. Ozvold, M., Hodulova, E., Chriastelova, J., Janovec, J., and Turna, M., "Lead-Free Solders: Comparative Study of Thermal and Wetting Properties," Metal 2008, Hradec and Moravici, May 13-15, 2008, Tanger, R. O., pp. 1-8.
11. Wu, C. M. L., Yu, D. Q., Law, C. M. T., and Wang, L., "The Properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements," J. Electron. Mater., Vol. 31, No. 9, 2002, pp. 921-927.
12. Suganuma, K. and Kim, K. S., "Sn-Zn Low Temperature Solder," J. Mater. Sci.: Mater. Electron., Vol. 18, 2007, pp. 121-127.
13. Lin, C. T. and Lin, K. L., "Contact Angle of 63Sn-37Pb and Pb Free Solder on Cu Plating," Appl. Surf. Sci., Vol. 214, 2003, pp. 243-258.
14. Islam, R. A., Wu, B. Y., Alam, M. O., Chan, Y. C., and Jillek, W., "Investigations on Microhardness of Sn-Zn Based Lead-Free Solder Alloys as Replacement of Sn-Pb Solder," J. Alloys Compd., Vol. 392, No. 1-2, 2005, pp. 149-158.
15. Chuang, T. H., Yen, S. F., and Cheng, M. D., "Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes," J. Electron. Mater., Vol. 35, 2, 2006, pp. 302-309.
16. Chang, T. C., Wang, M. C., and Hon, M. H., "Thermal Properties and Interfacial Reaction Between the Sn-9Zn-xAg Lead-Free Solders and Cu Substrate," Metall. Mater. Trans. A, Vol. 36A, 2005, pp. 3019-3029.
17. Schwartz, M. M. and Aircraft, S., Metals Handbook, 10th ed., American Society of Metals (ASM), Metals Park, OH, 1991, Vol. 6, pp. 126-129.
18. Frear, D. R., Jones, W. B., and Kinsman, K. R., Solder Mechanics-A State of the Art Assessment, TMS Publication, Warrendale, 1991, pp. 1-104.
19. Manko, H. H., Solders and Soldering, 3rd ed., McGraw-Hill, Inc., New York, 1992, pp. 1-153.
20. Lee, C. C. and Kim, J., "Fundamentals of Fluxless Soldering Technology," in Proceedings of the 10th IEEE International Advanced Packaging Materials Symposium, Irvine, CA, March 16-18, 2005, pp. 33-38.
21. Arenas, M. F. and Acoff, V. L., "Contact Angle Measurements of Sn-Ag and Sn-Cu Lead-Free Solders on Copper Substrates," J. Electron. Mater., Vol. 33, No. 12, 2004, pp. 1452-1458.
22. Ghosh, G., "Interfacial Reaction Between Multicomponent Lead-Free Solders and Ag, Cu, Ni and Pd Substrates," J. Electron. Mater., Vol. 33, No. 10, 2004, pp. 1080-1091.
23. Laurila, T., Vuorinen, V., and Kivilahti, J. K., "Interfacial Reactions Between Lead-Free Solders and Common Base Materials," Mater. Sci. Eng. R., Vol. 49, 2005, pp. 1-60.
24. Wang, H., Gao, F., Ma, X., and Qian, Y., "Reactive Wetting of Solders on Cu and Cu6Sn5/Cu3Sn/Cu Substrates Using Wetting Balance," Scr. Mater., Vol. 55, No. 9, 2006, pp. 823-826.
25. Shibata, H., Jiang, X., Valdez, M., and Cramb, A. W., "The Contact Angle Between Liquid Iron and a Single Crystal Magnesium Oxide Substrate at 1873 K," Metall. Mater. Trans. B, Vol. 35, 2004, pp. 179-181.
26. Lin, K. L., and Wang, Y. C., "Wetting Interaction of Pb-Free Sn-Zn-Al Solders on Metal Plated Substrate," J. Electron. Mater., Vol. 27, No. 11, 1998, pp. 1205-1210.
27. Bukat, K., Sitek, J., Hozu, L., and Bulwith, R., "Solderability Assessment of Pb-Free Alloys Using VOC-Free Flux," Global SMT and Packaging Journal, Vol. 2, No. 9, 2002, pp. 1-8.0002-7820
28. Yu, D. Q., Zhao, J., and Wang, L., "Improvement on the Microstructure Stability, Mechanical and Wetting Properties of Sn-Ag-Cu Lead-Free Solder with the Addition of Rare Earth Elements," J. Alloys Compd., Vol. 376, 2004, pp. 170-175.
29. Yu, D. Q., Xie, H. P., and Wang, L., "Investigation of Interfacial Microstructure and Wetting Property of Newly Developed Sn-Zn-Cu Solders with Cu Substrate," J. Alloys Compd., Vol. 385, 2004, pp. 119-125.
30. Kang, S. C., Kim, C., Muncy, J., Schmidt, M., and Baldwin, D., "Experimental Wetting Dynamics Study of Eutectic and Lead-Free Solders Varying Flux, Temperature and Surface Finish Metallization," IEEE/SEMI Int'l Electronics Manufacturing Technology Symposium, July 14-16, 2004, IEEE/CPMT/SEMI, San Jose, CA, pp. 1-8.
31. Hong, S. M., Park, J. Y., Kang, C. S., and Jung, J. P., "Fluxless Wetting Properties of UBM-Coated Si-Wafer to Sn-3.5 wt% Ag Solder," IEEE Trans. Compon. Packag. Technol., Vol. 26-1, 2003, pp. 255-261.
32. Saiz, E., Hwang, C. W., Suganuma, K., and Tomsia, A. P., "Spreading of Sn-Ag Solders on Fe-Ni Alloys," Acta Mater., Vol. 51, 2003, pp. 3185-3197.
33. Yoon, S. W., Choi, W. K., and Lee, H. M., "Calculation of Surface Tension and Wetting Properties of Sn-Based Solder Alloys," Scr. Mater., Vol. 40, No. 3, 1999, pp. 297-302.
34. Takao, H., Tsukada, T., Yamada, K., Yamashita, M., and Hasegawa, H., "Development of Wettability Evaluation Technique Applying Contact Angle Measurement During Soldering," R&D Rev Toyota CRDL, Vol. 392, 2004, pp. 41-48. 0002-7820
35. Mackie, A. C., "Reflow Atmospheres in the Lead-Free Era," Circuits Assem., 2003, pp. 26-35.
36. Wang, H., Wang, F., Gao, F., Ma, X. and Qian, Y., "Reactive Wetting of Sn-0.7Cu-xZn Lead-Free Solders on Cu Substrate," J. Alloys Compd., Vol. 433-1, No. 2, 2007, pp. 302-305.
37. Mortensen, A., Drevet, B., and Eustathopoulos, N., "Kinetics of Diffusion-Limited Spreading of Sessile Drops in Reactive Wetting," Scr. Mater., Vol. 36, No. 6, 1997, pp. 645-651.
38. Chen, W. X., Xue, S. B., and Wang, H., "Wetting Properties and Interfacial Microstructures of Sn-Zn-xGa Solders on Cu Substrate," Mater. Des., Vol. 31, No. 4, 2010, pp. 2196-2200.
39. Chen, K. and Lin, K. L., "Effect of Gallium on Wettability, Microstructure and Mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys," International Symposium on Electronic Materials and Packaging, December 4-6, 2002, I-Shou University and IEEE/CPMT, Kaohsiung, Taiwan, pp. 49-54.
40. Suganuma, K., Muata, T., Noguchi, H., and Toyoda, Y., "Heat Resistance of Sn-9Zn Solder/Cu Interface with or Without Coating," J. Mater. Res., Vol. 15, No. 4, 2000, pp. 884-891.
41. Kitajima, M., and Shono, T., "Reliability Study of New SnZnAl Lead-Free Solders Used in CSP Packages," Microelectron. Reliab., Vol. 45, No. 7-8, 2005, pp. 1208-1214.
42. Prasad, L. C. and Mikula, A., "Role of Surface Properties on the Wettability of Sn-Pb-Bi Solder Alloys," J. Alloys Compd., Vol. 282, 1999, pp. 279-285.
43. Wang, L., Yu, D. Q., Zhao, J., and Huang, M. L., "Improvement of Wettability and Tensile Property in Sn-Ag-RE Lead Free Solder Alloy," Mater. Lett., Vol. 56, 2002, pp. 1039-1042.
44. Gao, L., Xue, S., Zhang, L., Xiao, Z., Dai, W., Ji, F., Ye, H., and Zeng, G., "Effect of Praseodymium on the Microstructure and Properties of Sn3.8Ag0.7Cu Solder," J. Mater. Sci.: Mater. Electron., Vol. 2009, in press.
45. Adamson, A. W. and Gast, A. P., Physical Chemistry of Surfaces, 6th ed., Wiley-Interscience, New York, 1997, pp. 347-379.
46. Morra, M., Occhiello, E., and Garbassi, F., "Knowledge About Polymer Surfaces from Contact Angle Measurements," Adv. Colloid Interface Sci., Vol. 32, 1990, pp. 79-116.
47. Yost, F. G., Michael, J. R., and Eisenmann, E. T., "Extensive Wetting Due to Roughness," Acta Mater., Vol. 43, No. 1, 1995, pp. 299-305.
48. Wolansky, G. and Marmur, A., "Apparent Contact Angles on Rough Surfaces: The Wenzel Equation Revisited," Colloids Surf., A, Vol. 156, 1999, pp. 381-388.
49. Nakae, H., Inui, R., Hirata, Y., and Saito, H., "Effects of Surface Roughness on Wettability," Acta Mater., Vol. 46, No. 7, 1998, pp. 2313-2318.
50. Lopez, V. H. and Kennedy, A. R., "Flux-Assisted Wetting and Spreading of Al on TiC," J. Colloid Interface Sci., Vol. 298, No. 1, 2006, pp. 356-362.
51. Claesson, E., Choquenet, L., and Nilson, M., "Atmosphere Influence on Reflow Soldering," Brasage, Vol. 97, 1997, pp. 1-5.
52. Vaynman, S. and Fine, M. E., "Development of Fluxes for Lead-Free Solders Containing Zinc," Scr. Mater., Vol. 41, No. 12, 1999, pp. 1269-1271.
53. Peebles, D. E., Peebles, H. C., and Ohlhausen, J. A., "Kinetics of the Isothermal Spreading of Tin on the Air-Passivated Copper Surface in the Absence of a Fluxing Agent," Colloids Surf., A, Vol. 144, 1998, pp. 89-114.
54. Plas, H. A. V., Cinque, R. B., Mei, Z., and Holder, H., "Assessment of Low Temperature Fluxes," Hewlett-Packard J., Vol. 48, No. 4, 1997, pp. 1-7.
55. Farooq, M., Ray, S., Sarkhel, A., and Goldsmith, C., "Evaluation of Lead (Pb) -Free Ceramic Ball Grid Array (CBGA): Wettability, Microstructure and Reliability," Electronic Components and Technology Conference, May 29-June 1, 2001, IEEE/CPMT, ECA, Orlando, FL, pp. 978-986.
56. Bernardin, J. D., Mudawar, I., Walsh, C. B., and Franses, E. I., "Contact Angle Temperature Dependence for Water Droplets on Practical Aluminum Surfaces," Int. J. Heat Mass Transfer, Vol. 40, No. 5, 1997, pp. 1017-1033.
57. Martorano, K. M., Martorano, M. A., and Brandi, S. D., "Effects of Solder Bath Temperature and Substrate Sheet Thickness on the Wetting Balance Curve," Tech. Bull. Polytech. Sch. of USP, Dept. Metall. Eng. Mater., 2004, pp. 1-14. 0002-7820
58. Landry, K., Rado, C., and Eustathopoulos, N., "Influence of Interfacial Reaction Rates on the Wetting Driving Force in Metal/Ceramic Systems," Metall. Mater. Trans. A, Vol. 27, 1996, pp. 3181-86.
59. Zhao, H., Wang, H. Q., Sekulic, D. P., and Qian, Y. Y., "Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder," J. Electron. Mater., Vol. 38, No. 9, 2009, pp. 1838-1845.
60. Zhao, H., Wang, H. Q., Sekulic, D. P., and Qian, Y. Y., "Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders," J. Electron. Mater., Vol. 38, No. 9, 2009, pp. 1846-1854.