Development of high strength Sn-Cu solder using copper particles at nanolength scale

Journal of Alloys and Compounds

Volumn 476, Issue 1-2, 2009, Pages 199-206

  Alam, M E ^a   Nai, S M L ^a   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Mechanical properties; Microstructure; Powder metallurgy; Sintering

Indexed keywords

CO-EFFICIENT OF THERMAL EXPANSIONS; COPPER PARTICLES; DENSE MATERIALS; DOMINATING FACTORS; EQUIAXED GRAINS; HIGH STRENGTHS; INTERMETALLIC COMPOUNDS; MICROWAVE SINTERING; PURE SN; SN-CU SOLDERS; ULTIMATE TENSILE STRENGTHS; YIELD STRENGTHS;

ALUMINUM POWDER METALLURGY; BRAZING; COPPER SMELTING; INTERMETALLICS; MECHANICAL PROPERTIES; METALLURGY; MICROSTRUCTURE; ORES; POWDERS; SINTERING; SOLDERING ALLOYS; STRENGTH OF MATERIALS; TENSILE STRENGTH; TENSILE TESTING; THERMAL EXPANSION; TITANIUM COMPOUNDS; WELDING;

TIN;

EID: 64549097659     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.09.061     Document Type: Article

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