Effect of Al2O3 addition in Sn-Ag-Cu solder balls on the microstructure and shearing strength of BGA packages with immersion Sn surface finish

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 374-378

  Cheng, T H ^a   Tsao, L C ^a   Wang, F S ^a   Kuo, W Y ^a  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL-SHEAR TEST; BGA PACKAGE; COMPOSITE SOLDERS; IMMERSION SN; INTERFACIAL MICROSTRUCTURE; LEAD-FREE; MICROELECTRONIC PACKAGING; MULTIPLE REFLOW CYCLES; REFLOW CYCLES; SAC-SOLDERS; SECOND PHASE; SHEARING STRENGTH; SNAGCU SOLDER; SNPB SOLDER; SOLDER JOINTS; SURFACE FINISHES;

ALUMINUM; ELECTRONICS PACKAGING; INTERMETALLICS; MICROELECTRONICS; MICROSTRUCTURE; NANOPARTICLES; PACKAGING; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 81355142532     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066856     Document Type: Conference Paper

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