Effect of Ag content on solidification cracking susceptibility of Sn-Ag-Cu solder joints

Journal of Electronic Materials

Volumn 39, Issue 8, 2010, Pages 1298-1302

  Lu, Wei ^a   Shi, Yaowu ^a   Lei, Yongping ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Cracking susceptibility; Sn Ag Cu solder joints; Solidification cracks

Indexed keywords

CRACK LENGTH; CRACKING SUSCEPTIBILITY; SN-3.8AG-0.7CU SOLDER; SNAGCU SOLDER; SOLDER JOINTS; SOLIDIFICATION CRACKING; SOLIDIFICATION CRACKING SUSCEPTIBILITY; SOLIDIFICATION CRACKS;

CRACKING (CHEMICAL); CRACKS; CRYSTALLIZATION; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 77954625455     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1175-7     Document Type: Article

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