Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/ immersion Au/electroless Ni solder joints after aging

Materials Science and Engineering: B

Volumn 177, Issue 2, 2012, Pages 278-282

  Wang, I Tai ^a   Duh, Jenq Gong ^a   Cheng, Chih Yuan ^b   Wang, Jim ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b Micro Material Institute   (Taiwan)

Author keywords

Electroless Ni immersion Au; Interfacial reaction; Microstructure; Pd doping; SnAgCu solder

Indexed keywords

COPPER ALLOYS; GOLD; INTERMETALLICS; LEAD-FREE SOLDERS; PALLADIUM; SILVER ALLOYS; SOLDERED JOINTS; TERNARY ALLOYS; TIN ALLOYS;

AU-NI SYSTEM; ELECTROLESS NI; ELECTROLESS NI/IMMERSION AU; ELECTRON PROBE MICRO ANALYZER; ELEMENTAL REDISTRIBUTION; FIELD-EMISSION ELECTRONS; INTERMETALLICS COMPOUNDS; PD DOPING; SNAGCU SOLDER; SOLDER JOINTS;

THERMAL AGING;

EID: 84855817950     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2011.12.011     Document Type: Article

References (19)

1. T. Laurila, V. Vuorinen, and J.K. Kivilahti Mater. Sci. Eng. R 49 2005 1 60
2. M. Abtew, and G. Selvaduray Mater. Sci. Eng. R 27 2000 95 141
3. K. Zeng, and K.N. Tu Mater. Sci. Eng. R 38 2002 55 105
4. G.Y. Jang, J.G. Duh, H. Takahashi, S.W. Lu, and J.C. Chen J. Electron. Mater. 35 2006 1745 1754
5. W. Peng, E. Monlevade, and M.E. Marques Microelectron. Reliab. 47 2007 2161 2168
6. J.W. Jang, P.G. Kim, and K.N. Tu J. Appl. Phys. 85 1999 8456 8463
7. K. Suganuma, and K.S. Kim JOM 60 2008 61 65
8. K. Zeng, R. Stierman, D. Abbott, and M. Murtuza JOM 58 2006 75 79
9. G. Milad, and M. Orduz Met. Finish. 105 2007 25 28
10. Y.D. Jeon, Y.B. Lee, and Y.S. Choi Thin electroless Cu/OSP on electroless Ni as a novel surface finish for flip chip solder joints Electronic Components and Technology Conference 2006
11. Y. Oda, M. Kiso, S. Kurosaka, A. Okada, K. Kitajima, S. Hashimoto, and D. Gudeczauskas Study of suitable palladium and gold thickness in ENEPIG deposits for lead free soldering and gold wire bonding 41st International Symposium Microelectronics 2008
12. C.T. Lu, H.W. Tseng, C.H. Chang, T.S. Huang, and C.Y. Liu Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer Appl. Phys. Lett. 96 2010 232103-233103-3
13. M. Yu, J.K. Kim, J.H. Lee, and M.S. Kim Mater. Res. Bull. 45 2010 359 361
14. Y. Oda, M. Kiso, and S. Hashimoto IMC growth study on Ni-P/Pd/Au film and Ni-P/Au film using Sn/Ag/Cu lead-free solder IMAPS 2007
15. Y.C. Lin, K.J. Wang, and J.G. Duh J. Electron. Mater. 39 2010 283
16. F. Gao, and T. Takemoto J. Alloys Compd. 421 2006 283 288
17. J.Y. Tsai, Y.C. Hu, C.M. Tsai, and C.R. Kao J. Electron. Mater. 32 2003 1203 1208
18. M. Mathon, M. Gambino, E. Hayer, M. Gaune-Escard, and J.P. Bros J. Alloys Compd. 285 1999 123 132
19. C. Yu, J. Liu, H. Lu, P. Li, and J. Chen Intermetallics 15 2007 1471 1478