SAC 305 solder paste with carbon nanotubes - Part I: Investigation of the influence of the carbon nanotubes on the SAC solder paste properties

Soldering and Surface Mount Technology

Volumn 24, Issue 4, 2012, Pages 267-279

  Bukat, K ^a   Sitek, J ^a   Koscielski M ^a   Jakubowska, M ^b   Sloma M ^b   Mlozniak A ^c   Niedzwiedz W ^b  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

Carbon nanotubes; Nano SAC solder paste; Nano SAC solder paste properties; Solder paste; Soldering technology

Indexed keywords

ASSEMBLY PROCESS; COMPARISON STUDY; COPPER SUBSTRATES; DE-WETTING; DESIGN/METHODOLOGY/APPROACH; DISPERSION METHODS; ELECTRONIC ELEMENTS; FUNCTIONALIZATIONS; GROWTH REDUCTION; MICROSTRUCTURAL ANALYSIS; MICROSTRUCTURAL CHANGES; NANO POWDERS; NANOTUBE DISPERSIONS; NEGATIVE INFLUENCE; NON-WETTING; PRACTICAL IMPLEMENTATION; REFLOW--SOLDERING; REINFORCEMENT EFFECTS; SAC-SOLDERS; SILVER NANOPOWDER; SOLDER BALLS; SOLDER JOINTS; SOLDER PASTE; SOLDERING TECHNOLOGY; STRUCTURAL MODIFICATIONS; STRUCTURE MODIFICATION; TECHNOLOGICAL PROPERTIES; TWO-STAGE METHODS;

AUTOMOBILE MANUFACTURE; CARBON NANOTUBES; DISPERSIONS; ESTERIFICATION; ESTERS; FLIP CHIP DEVICES; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; POLYCHLORINATED BIPHENYLS; SILVER ALLOYS; WETTING;

SOLDERING;

EID: 84866983608     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911211262557     Document Type: Article

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