Reliability behavior of lead-free solder joints in electronic components

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 1, 2013, Pages 172-190

  Zhang, Liang ^a,b   Han, Ji Guang ^a   He, Cheng Wen ^a   Guo, Yong Huan ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP CARRIER; CIRCUIT BOARDS; CREEP-FATIGUE INTERACTIONS; ELECTRONIC COMPONENT; ELECTRONICS ASSEMBLY; ELECTRONICS COMPONENTS; ELECTRONICS DEVICES; ENVIRONMENTALLY-FRIENDLY; EXPANSION COEFFICIENTS; FATIGUE LIFE PREDICTION; FINITE ELEMENT SIMULATIONS; LEAD FREE ELECTRONICS; LEAD-FREE SOLDER JOINT; MATERIALS BEHAVIOR; MECHANICAL CONNECTIONS; MICRO ELECTRO MECHANICAL SYSTEM; PB-FREE; RELATIVE DISPLACEMENT; RELIABILITY BEHAVIOR; SOLDER JOINTS;

CONSTITUTIVE EQUATIONS; CONSUMER PRODUCTS; ELECTRONICS PACKAGING; FATIGUE DAMAGE; LEAD; MEMS; MICROELECTRONICS; ZINC OXIDE;

RELIABILITY;

EID: 84871971344     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0720-y     Document Type: Review

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