Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Microelectronics Reliability

Volumn 51, Issue 12, 2011, Pages 2306-2313

  Gain, Asit Kumar ^a   Chan, Y C ^a   Yung, Winco K C ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; DIMPLED SURFACES; DUCTILE FAILURES; EFFECT OF ADDITION; FRACTURE SURFACES; IMC LAYER; INTERFACIAL MORPHOLOGIES; MATRIX; NANO-SIZED; PARTICLES REINFORCED; REFLOW CYCLES; REINFORCING PARTICLES; SECOND PHASE; SMOOTH SURFACE; SN-AG-CU; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS;

BRITTLE FRACTURE; DISPERSIONS; DUCTILE FRACTURE; GOLD ALLOYS; INTERMETALLICS; METALLIZING; NANOPARTICLES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; ZIRCONIUM ALLOYS;

TIN;

EID: 81855194315     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.03.042     Document Type: Article

References (25)

1. H.B. Kang, J.H. Bae, J.W. Lee, M.H. Park, Y.C. Lee, and J.W. Yoon Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints Scr Mater 60 2009 257 260
2. A.K. Gain, C.H. Chan, and W.K.C. Yung Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages Mater Sci Eng B 162 2009 92 98
3. P. Yao, P. Liu, and J. Liu Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C Microelectron Eng 477 2008 552 559
4. B. Vandevelde, M. Gonzalez, P. Limaye, P. Ratchev, and E. Beyne Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages Microelectron Reliab 47 2007 259 265 (Pubitemid 46177075)
5. 3 as reinforcement Adv Eng Mater 7 11 2005 1049 1053
6. U.S. Mohanty, and K.L. Lin Electrochemical corrosion behavior of Pb-free Sn-8.5Zn-0.05Al-xGa and Sn-3Ag-0.5Cu alloy in chloride containing aqueous solution Corros Sci 50 2008 2437 2443
7. G. Ghosh Dissolution and interfacial reactions of thin-flim Ti/Ni/Ag metallizations in solder joints Acta Mater 49 2001 2609 2624 (Pubitemid 32672826)
8. M. Abtew, and G. Selvaduray Lead-free solders in microelectronics Mater Sci R 27 2000 95 141
9. D. Li, C. Liu, and P.P. Conway Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects Mater Sci Eng A 391 2005 95 103 (Pubitemid 40071762)
10. C.H. Wang, and S.W. Chen Sn-0.7 wt%Cu/Ni interfacial reactions at 250 °C Acta Mater 45 2006 247 253
11. A. Choubey, H. Yu, M. Osterman, M. Pecht, F. Yun, and L. Yonghong Intermetallics characterization of lead-free solder joints under isothermal aging J Electron Mater 37 8 2008 1130 1138
12. W.H. Zhong, Y.C. Chan, M.O. Alam, B.Y. Wu, and J.F. Guan Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints J Alloy Compd 414 2006 123 130
13. ° J Alloy Compd 381 2004 202 207
14. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test Scr Mater 51 2004 641 645
15. F. Gao, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, and K.N. Suramanian Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles J Electron Mater 30 2001 1073 1082 (Pubitemid 33090669)
16. S.M.L. Nai, J. Wei, and M. Gupta Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites Thin solid Films 504 2006 401 404
17. 2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads J Alloy Compd 477 2009 552 559
18. H. Mavoori, and S. Jin New creep-resistant, low melting point solders with ultrafine oxide dispersions J Electron Mater 27 11 1998 1216 1222 (Pubitemid 128573786)
19. F. Gao, J.P. Lucas, and K.N. Subramanian Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu noncomposite solder joints J Mater Sci Mater Electron 12 1 2001 27 35 (Pubitemid 32471237)
20. F. Gao, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, and K.N. Subramanian Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles J Electron Mater 30 9 2001 1073 1082 (Pubitemid 33090669)
21. 2 particulate-reinforced lead-free solder composite J Mater Sci Technol 22 4 2006 529 532 (Pubitemid 44513012)
22. K.K. Mohan, V. Kripesh, and A.A.O. Tay Single-wall carbon nanotube (SWCNT) functionlized Sn-Ag-Cu lead-free composite solders J Alloy Compd 450 2008 229 237 (Pubitemid 350298765)
23. J.W. Yoon, S.W. Kim, and S.B. Jung IMC morphology interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate J Alloy Compd 392 2005 247 253
24. B. Li, Y. Shi, Y. Lei, F. Guo, Z. Xia, and B. Zong Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint J Electron Mater 34 3 2005 217 224 (Pubitemid 40520275)
25. G.J. Zhang, Y.J. Sun, R.M. Niu, J. Sun, J.F. Wie, and B.H. Zhao Microstructure and strengthening mechanism of oxide Lanthanum dispersion strengthened Molybdenum alloy Adv Eng Mater 6 12 2004 943 948 (Pubitemid 40087002)