Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 7, 2011, Pages 703-716

  Kim, Doosoo ^a   Chang, Jong Hyeon ^a   Park, Jungil ^a   Pak, James Jungho ^a  

^a Korea University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-SCALE; CRITICAL VARIABLES; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING INDUSTRY; FINE PITCH; IMC LAYER; INTERDIFFUSION PROCESS; INTERMETALLIC LAYER; KINETIC PROCESS; KIRKENDALL VOID; MICROSTRUCTURE CHANGES; PEAK TEMPERATURES; SECOND LEVEL; SEMICONDUCTOR PACKAGES; SILICON DIE; SOLDER JOINTS; SOLID-LIQUID; SUBMICRON; TEMPERATURE DEPENDENT;

CHIP SCALE PACKAGES; INTERMETALLICS; SEMICONDUCTING SILICON; SILICON COMPOUNDS; SOLDERED JOINTS;

SOLDERING ALLOYS;

EID: 80051667739     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0357-2     Document Type: Article

References (51)

1. C.Y. Liu, K.N. Tu, T.T. Sheng, C.H. Tung, D.R. Frear, P. Elenius, J. Appl. Phys. 87, 750 (2000)
2. P.S. Teo, Y.-W. Huang, C.H. Tung, M.R. Marks, T.B. Lim, 50th Electronic Components and Technology Conference, Las Vegas, NV, USA, p. 33 (2000)
3. K.N. Tu, K. Zeng, Mater. Sci. Eng. R 34, 1 (2001)
4. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)
5. E.O. Kirkendall, Trans. AIME 147, 104 (1942)
6. A.D. Smigelskas, E.O. Kirkendall, Trans. AIME 171, 130 (1947)
7. F. Seitz, Physical Rev. 74, 1513 (1948)
8. F.D. Fischer, J. Svoboda, Scr. Mater. 58, 93 (2008)
9. K. Weinberg, T. Bohme, IEEE Trans. Components Packag. Technol. 32, 684 (2009)
10. K. Weinberg, T. Böhme, W.H. Müller, Comput. Mater. Sci. 45, 827 (2009)
11. W. Yang, R. Messler, L. Felton, J. Electron. Mater. 23, 765 (1994)
12. K. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, K.N. Tu, J. Appl. Phys. 97, 024508 (2005)
13. T.-C. Chiu, K. Zeng, R. Stierman, D. Edwards, K. Ano, 54th Electronic Components and Technology Conference, Las Vegas, Nevada, USA, vol. 2, p. 1256 (2004)
14. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K.N. Tu, 54th Electronic Components and Technology Conference, vol. 1, p. 668 (2004)
15. S. Ahat, M. Sheng, L. Luo, J. Electron. Mater. 30, 1317 (2001)
16. D.R. Frear, F.M. Hosking, P.T. Vianco, 4th Electronic Materials and Processing Congress Montreal, Quebec, Canada, p. 229 (1991)
17. K.C. Hung, Y.C. Chan, C.W. Tang, H.C. Ong, J. Mater. Res. 15, 2534 (2000)
18. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, P. Thompson, J. Appl. Phys. 85, 8456 (1999)
19. P.G. Kim, J.W. Jang, T.Y. Lee, K.N. Tu, J. Appl. Phys. 86, 6746 (1999)
20. R.J.K. Wassink, Soldering in Electronics. Electrochemical Publications Limited (Isle of Man, British Isle, 1989)
21. M. Li, F. Zhang, W.T. Chen et al., J. Mater. Res. 17, 1612 (2002)
22. K. Zeng, V. Vuorinen, J.K. Kivilahti, 51st Electronic Components and Technology Conference, Orlando, FL, USA, p. 693 (2001)
23. K.J. Zeng, V. Vuorinen, J.K. Kivilahti, IEEE Trans. Electron. Packag. Manuf. 25, 162 (2002)
24. K.J. Ronka, F.J.J. van Loo, J.K. Kivilahti, Scr. Mater. 37, 1575 (1997)
25. F.J.J. van Loo, J.A. van Beek, G.F. Bastin, R. Metselaar, Symposium on Diffusion in Solids: Recent Developments, Ditroit, MI, USA, p. 231 (1985)
26. K. Zeng, J. Kivilahti, J. Electron. Mater. 30, 35 (2001)
27. K.N. Tu, R.D. Thompson, Acta Metall. 30, 947 (1982)
28. T.Y. Lee, W.J. Choi, K.N. Tu et al., J. Mater. Res. 17, 291 (2002)
29. K. Tu, F. Ku, T. Lee, J. Electron. Mater. 30, 1129 (2001)
30. K.N. Tu, T.Y. Lee, J.W. Jang et al., J. Appl. Phys. 89, 4843 (2001)
31. L. Xu, J.H.L. Pang, 56th Electronic Components and Technology Conference, San Diego, CA, USA, p. 275 (2006)
32. F. Gao, H. Nishikawa, T. Takemoto, J. Electron. Mater. 37, 45 (2008)
33. X. Lin, L. Luo, J. Electron. Mater. 37, 307 (2008)
34. C.K. Hu, H.B. Huntington, G.R. Gruzalski, Phys. Rev. B 28, 579 (1983)
35. H.K. Kim, K.N. Tu, Phys. Rev. B 53, 16027 (1996)
36. Z. Mei, A. Sunwoo, J. Morris, Metallurg Mater. Trans. A 23, 857 (1992)
37. H.K. Kim, H.K. Liou, K.N. Tu, Appl. Phys. Lett. 66, 2337 (1995)
38. C.Y. Liu, K.N. Tu, J. Mater. Res. 13, 37 (1998)
39. Y.-C. Hsu, T.-L. Shao, C.-J. Yang, C. Chen, J. Electron. Mater. 32, 1222 (2003)
40. J.W. Nah, F. Ren, K.W. Paik, K.N. Tu, J. Mater. Res. 21, 698 (2005)
41. K.N. Tu, Phys. Rev. B 45, 1409 (1992)
42. M. Ding, H. Matsuhashi, G. Wang, P. S. Ho, 54th Electronic Components and Technology Conference, Las Vegas, Nevada, USA, vol. 1, p. 968 (2004)
43. Y.C. Hu, Y.H. Lin, C.R. Kao, K.N. Tu, J. Mater. Res. 18, 2544 (2003)
44. J.D. Wu, P.J. Zheng, C.W. Lee, S.C. Hung, J.J. Lee, 41st Annual Reliability Physics Symposium Proceedings, p. 132 (2003)
45. A.S. Nowick, J.J. Burton, Diffusion in Solids-Recent Developments (Academic, New York), 1975)
46. H. Gan, K.N. Tu, J. Appl. Phys. 97, 063514 (2005)
47. M. Ding, G. Wang, B. Chao, P.S. Ho, P. Su, T. Uehling, J. Appl. Phys. 99, 094906 (2006)
48. S. Choi, J.P. Lucas, K.N. Subramanian, T.R. Bieler, J. Mater. Sci. Mater. Electron. 11, 497 (2000)
49. D.A. Porter, K.E. Easterling, Phase Transformations in Metals and Alloys (Van Nostrand Reinhold, New York, 1981)
50. R.E. Reed-Hill, Physical Metallurgical Principles (Van Nostrand Company, New York, 1973)
51. F. Ren, J.W. Nah, J.O. Suh, et al., Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, p. 66 (2005)