Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Materials Science and Engineering: A

Volumn 558, Issue , 2012, Pages 478-484

  Chuang, C L ^a   Tsao, L C ^b   Lin, H K ^b   Feng, L P ^b  

^a CHUNG SHAN MEDICAL UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Mechanical property; Sn3.5Ag0.5Cu solder; Ti

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; LEAD-FREE SOLDERS; MECHANICAL PROPERTIES; MELTING; MICROSTRUCTURE; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS;

EUTECTIC COLONIES; INTER-METALLIC COMPOUNDS; MELTING RANGE; MICROSTRUCTURAL ANALYSIS; MICROSTRUCTURE AND PROPERTIES; PHYSICAL AND MECHANICAL PROPERTIES; SAC-SOLDERS; SOLDER ALLOYS;

TITANIUM;

EID: 84866277406     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.08.031     Document Type: Article

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