Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint

Microelectronics Reliability

Volumn 48, Issue 11-12, 2008, Pages 1864-1874

  Yoon, Jeong Won ^a   Noh, Bo In ^a   Lee, Young Ho ^b   Lee, Hyo Soo ^c   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

^c Korea Institute of Industrial Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASSOCIATION REACTIONS; BRAZING; COMPUTER OPERATING PROCEDURES; COPPER; METEOROLOGY; MOISTURE; RELIABILITY; SILVER; SOLDERING ALLOYS; TESTING; TIN; WELDING;

CU SUBSTRATES; INTERFACIAL REACTIONS; ISOTHERMAL AGING; JOINT RELIABILITIES; MECHANICAL RELIABILITIES; ORGANIC SOLDERABILITY PRESERVATIVES; SHEAR FORCES; SHEAR TESTS; SOLDER JOINTS; TWO TYPES; VOID FORMATIONS;

SUBSTRATES;

EID: 55749110016     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.065     Document Type: Article

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