Thermal behavior and microstructure of the intermetallic compounds formed at the Sn-3Ag-0.5Cu/Cu interface after soldering and isothermal aging

Journal of Crystal Growth

Volumn 290, Issue 1, 2006, Pages 103-110

  Liu, Chih Yao ^a   Lai, Chien Hong ^b   Wang, Moo Chin ^b   Hon, Min Hsiung ^a,c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^c DA YEH UNIVERSITY   (Taiwan)

Author keywords

A1. Diffusion; A1. Eutectics; A1. Interfaces; A1. X ray diffraction; B1. Alloys

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY (DSC); INTERFACES; ISOTHERMAL AGING; PUL OFF TESTING;

ALLOYS; CRYSTAL MICROSTRUCTURE; DIFFUSION; EUTECTICS; INTERFACES (MATERIALS); ISOTHERMS; SCANNING ELECTRON MICROSCOPY; SOLDERING; THERMAL EFFECTS; TIN; X RAY DIFFRACTION ANALYSIS;

SEMICONDUCTING INTERMETALLICS;

EID: 33645019865     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcrysgro.2005.12.090     Document Type: Article

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