Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Materials Science and Engineering: B

Volumn 171, Issue 1-3, 2010, Pages 162-171

  Tsukamoto, H ^a   Nishimura, T ^b   Suenaga, S ^b   Nogita, K ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b Nihon Superior Co Ltd   (Japan)

Author keywords

Ball grid array; Impact strength; Intermetallic compounds; Lead free solder

Indexed keywords

BALL GRID ARRAYS; HEAT RESISTANCE; INTERFACES (MATERIALS); INTERMETALLICS; LEAD-FREE SOLDERS; SHEAR FLOW; SOLDERED JOINTS; SOLDERING; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS;

AU SURFACES; BALL-GRID ARRAYS; DISPLACEMENT RATE; INTERMETALLICS COMPOUNDS; LEAD FREE SOLDER BALLS; NI-DOPED; SHEAR TESTS; SUBSTRATE INTERFACE; TENSILE IMPACT BEHAVIOR; TENSILE IMPACT STRENGTH;

IMPACT STRENGTH;

EID: 77953133527     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2010.03.092     Document Type: Article

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