Reexamination of the solder ball shear test for evaluation of the mechanical joint strength

International Journal of Solids and Structures

Volumn 43, Issue 7-8, 2006, Pages 1928-1945

  Kim, Jong Woong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball grid array; Finite element analysis; Pb free solder; Shear height; Shear speed

Indexed keywords

ELASTIC MODULI; ENERGY DISPERSIVE SPECTROSCOPY; FINITE ELEMENT METHOD; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; STATISTICAL METHODS;

BALL GRID ARRAYS; PB FREE SOLDER; SHEAR HEIGHT; SHEAR SPEED;

SOLDERING ALLOYS;

EID: 32344450315     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2005.07.014     Document Type: Article

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