Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

Journal of Materials Science: Materials in Electronics

Volumn 17, Issue 3, 2006, Pages 171-178

  Lu, Henry Y ^a   Balkan, Haluk ^a   Ng, K Y Simon ^b  

^a FlipChip International LLC   (United States)

^b Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COMPOSITION EFFECTS; CRYSTAL MICROSTRUCTURE; CRYSTAL SYMMETRY; DIFFERENTIAL SCANNING CALORIMETRY; HEAT TREATMENT; MICROSCOPIC EXAMINATION; MORPHOLOGY; SILVER;

CROSS SECTION MICROSCOPY; ISOTHERMAL AGING; SHEAR TEST; SURFACE MICROETCHING MICROSCOPY;

SEMICONDUCTING TIN COMPOUNDS;

EID: 33646390119     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-6758-y     Document Type: Article

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