Effect of Pd thickness on the interfacial reaction and shear strength in solder joints between Sn-3.0Ag-0.5Cu solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish

Journal of Electronic Materials

Volumn 41, Issue 4, 2012, Pages 763-773

  Kim, Young Min ^a   Park, Jin Young ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

ENEPIG; interfacial microstructure; mechanical strength; Pb free solder; Pd thickness

Indexed keywords

ADVERSE EFFECT; BALL-SHEAR TEST; ELECTROLESS NICKEL; ENEPIG; HIGH STRAIN RATES; HIGH-SPEED; INTERFACIAL FRACTURE; INTERFACIAL MICROSTRUCTURE; INTERFACIAL STRENGTH; PB FREE SOLDERS; REFLOW CONDITIONS; REFLOW--SOLDERING; SAC-SOLDERS; SN-3.0AG-0.5CU; SOLDER INTERFACES; SOLDER JOINTS; STRENGTH VALUES; SURFACE FINISHES;

FINISHING; FLIP CHIP DEVICES; FRACTURE; GOLD; LEAD; LEAD COMPOUNDS; PHASE INTERFACES; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; STRENGTH OF MATERIALS;

TIN;

EID: 84862796287     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-1921-0     Document Type: Article

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