An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu-XTiO2 composite solders as functions of alloy composition and cooling rate

Materials Science and Engineering: A

Volumn 529, Issue 1, 2011, Pages 41-48

  Tsao, L C ^a  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Mechanical property; Sn3.5Ag0.5Cu composite solder

Indexed keywords

BINARY ALLOYS; COOLING; COPPER ALLOYS; GRAIN BOUNDARIES; LEAD-FREE SOLDERS; MECHANISMS; MELTING POINT; MICROSTRUCTURE; NANOPARTICLES; SILVER ALLOYS; SOLDERING; SOLIDIFICATION; TENSILE STRENGTH; TERNARY ALLOYS; TIN ALLOYS; TITANIUM ALLOYS;

ADDITION RATE; ALLOY COMPOSITIONS; COMPOSITE SOLDERS; COOLING RATES; MECHANICAL BEHAVIOR; MICROSTRUCTURES AND MECHANICAL PROPERTIES; NANOPARTICLE ADDITION; SN3.5AG0.5CU COMPOSITE SOLDER; SOLDER ALLOYS; TEMPERATURE BEHAVIOR;

TITANIUM DIOXIDE;

EID: 80054078864     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.08.053     Document Type: Article

References (27)

1. Tu K.N., Zeng K. Mater. Sci. Eng. R 2001, 34:1-58.
2. Leong J.C., Tsao L.C., Fang C.J., Chu C.P. J. Mater. Sci.: Mater. Electron. 2011, 22:1443-1449.
3. Chuang T.H., Yen S.F., Cheng M.D. J. Electron. Mater. 2006, 35:302-309.
4. Shen J., Chan Y.C. Microelectron. Reliab. 2009, 49:223-234.
5. Tsao L.C., Chang S.Y. Mater. Des. 2010, 31:990-993.
6. Tsao L.C., Chang S.Y., Lee C.I., Sun W.H., Huang C.H. Mater. Des. 2010, 31:4831-4835.
7. Shen J., Liu Y.C., Wang D.J., Gao H.X. J. Mater. Sci. Technol. 2006, 22:529-532.
8. Zhong X.L., Gupta M. J. Phys. D: Appl. Phys. 2008, 41:95403-95409.
9. Mohan Kumar K., Kripesh V., Tay A.A.O. J. Alloys Compd. 2008, 450:229-237.
10. Nai S.M.L., Wei J., Gupta M. Mater. Sci. Eng. A 2006, 423:166-169.
11. Nai S.M.L., Wei J., Gupta M. Thin Solid Films 2006, 504:401-404.
12. Tsao L.C., Chu C.P., Peng S.F. Microelectron. Eng. 2011, 88:2964-2969.
13. Shen J., Liu Y.C., Han Y.J., Tian Y.M., Gao H.X. J. Electron. Mater. 2006, 35:1672-1679.
14. Lin D.C., Liu S., Guo T.M., Wang G.-X., Srivatsan T.S., Petraroli M. Mater. Sci. Eng. A 2003, 360:285-292.
15. Song J.M., Lin J.J., Huang C.F., Chuang H.Y. Mater. Sci. Eng. A 2007, 466:9-17.
16. Tsao L.C. J. Alloys Compd. 2011, 509:2326-2333.
17. Xia Z., Chen Z., Shi Y., Mu N., Sun N. J. Electron. Mater. 2002, 31:564-567.
18. Zhao X.Y., Zhao M.Q., Cui X.Q., Tong M.X. Trans. Nonferrous Met. Soc. China 2007, 17:805-810.
19. Wu C.M.L., Yu D.Q., Law C.M.T., Wang L. J. Mater. Res. 2002, 17:3146-3154.
20. Chuang T.H., Wu M.W., Chang S.Y., Ping S.F., Tsao L.C. J. Mater. Sci.: Mater. Electron 2011, 22:1021-1027.
21. Liu P., Yao P., Liu J. J. Electron. Mater. 2008, 37:874-879.
22. Lin D.C., Wang G.X., Srivatsana T.S., Al-Hajri M., Petraroli M. Mater. Lett. 2003, 57:3193-3198.
23. Callister W.D. Fundamentals of Materials Science and Engineering 2004, Wiley & Sons, New York, p. 252. 2nd ed.
24. Zhang Q., Chen D.L. Scripta Mater. 2004, 51:863-867.
25. Zhang Z., Chen D.L. Mater. Sci. Eng. A 2008, 483-484:148-152.
26. Mavoori H., Jin S. J. Electron. Mater. 1998, 27:1216-1222.
27. Yaowu S., Jianping L., Zhidong X., Yongping L., Fu G., Xiaoyan L. J. Mater. Sci.: Mater. Electron. 2008, 19:349-356.