IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

Journal of Alloys and Compounds

Volumn 537, Issue , 2012, Pages 87-99

  Abdelhadi, Ousama M ^a   Ladani, Leila ^a  

^a University of Alabama   (United States)

Author keywords

Activation energy; Chemical reaction and diffusion kinetics; Intermetallic growth; Sn 3.5Ag solders

Indexed keywords

APPARENT ACTIVATION ENERGY; BONDING TEMPERATURES; COMPOUND LAYER; CU SUBSTRATE; DIFFUSION CONTROLLED GROWTH; DIFFUSION KINETICS; DIFFUSION MECHANISMS; DIFFUSION RATE CONSTANTS; GROWTH STAGES; IMC LAYER; IMC THICKNESS; INITIAL STAGES; INTERMETALLIC GROWTH; INTERMETALLIC PHASIS; LINEAR RELATIONSHIPS; LIQUID SOLDERS; LIQUID SOLIDS; MICROSTRUCTURAL ANALYSIS; MODELING RESULTS; PHYSICS-BASED; POWER-LAW; SEVEN-LEVEL; SN-3.5AG; SN-3.5AG SOLDERS; SOLDERING PROCESS; SOLDERING TEMPERATURE; TEMPERATURE INCREASE;

ACTIVATION ENERGY; CHEMICAL REACTIONS; DIFFUSION; GROWTH KINETICS; INTERMETALLICS; LIQUIDS; RATE CONSTANTS; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84862773526     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2012.04.068     Document Type: Article

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