Recrystallization and precipitate coarsening in Pb-Free solder joints during thermomechanical fatigue

Journal of Electronic Materials

Volumn 41, Issue 2, 2012, Pages 241-252

  Yin, Liang ^a   Wentlent, Luke ^b   Yang, Linlin ^b   Arfaei, Babak ^b   Oasaimeh, Awni ^b   Borgesen, Peter ^b  

^a UNIVERSAL INSTRUMENTS CORPORATION   (United States)

^b State University of New York   (United States)

Author keywords

microstructure; Pb free solder; precipitate coarsening; recrystallization; thermomechanical fatigue

Indexed keywords

COMPONENT DESIGN; DAMAGE ACCUMULATION MODELS; EXPERIMENTAL OBSERVATION; FATIGUE CRACKS; INTERGRANULAR FRACTURE; PB FREE SOLDERS; PRECIPITATE COARSENING; RECRYSTALLIZATIONS; RECRYSTALLIZED GRAINS; SECONDARY PRECIPITATES; SN GRAINS; SNAGCU SOLDER; SOLDER JOINTS; THERMOMECHANICAL FATIGUE;

COARSENING; CRACKS; FATIGUE CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; GRAIN BOUNDARY SLIDING; MICROSTRUCTURE; PACKAGING MATERIALS; PRECIPITATES; RECRYSTALLIZATION (METALLURGY); SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84855424942     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1762-2     Document Type: Article

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