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Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 9, 2012, Pages 1705-1710

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

(4) Liu, Yang a Sun, Fenglian a Zhang, Hongwu a Zou, Pengfei a

a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; DISPERSION STRENGTHENING; GRAIN SIZE; MELTING RANGE; SHEAR BEHAVIOR; SOLDER ALLOYS; SOLDER JOINTS; SOLDERABILITY; SOLDERING PROCESS; SOLID SOLUTION STRENGTHENING;

BISMUTH COMPOUNDS; INTERMETALLICS; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

COPPER ALLOYS;

EID: 84864886723 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-012-0649-1 Document Type: Article

Times cited : (37)

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