Ball impact responses of Ni- or Ge-doped Sn-Ag-Cu solder joints

Journal of Electronic Materials

Volumn 37, Issue 2, 2008, Pages 201-209

  Lai, Yi Shao ^a   Song, Jenn Ming ^b   Chang, Hsiao Chuan ^a   Chiu, Ying Ta ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b NATIONAL DONG HWA UNIVERSITY   (Taiwan)

Author keywords

Ball impact test (BIT); Board level drop reliability; Solder joint; Substrate pad surface finish

Indexed keywords

BALL IMPACT TEST (BIT); BOARD-LEVEL DROP RELIABILITY; FRACTOGRAPHIES; SUBSTRATE PAD SURFACE FINISH;

DOPING (ADDITIVES); IMPACT TESTING; INTERMETALLICS; RELIABILITY THEORY; SEMICONDUCTING GERMANIUM;

SOLDERED JOINTS;

EID: 37249035185     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0319-x     Document Type: Article

References (22)

1. E.H. Wong, R. Rajoo, Y.-W. Mai, S.K.W. Seah, K.T. Tsai, L.M. Yap, Proceedings of the 55th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2005), p. 1202.
2. C.-L. Yeh, Y.-S. Lai, H.-C. Chang, T.-H. Chen, Microelectron. Reliab. 47, 1127 (2007).
3. Y.-S. Lai, P.-F. Yang, C.-L. Yeh, Microelectron. Reliab. 46, 645 (2006).
4. D.Y.R. Chong, F.X. Che, J.H.L. Pang, K. Ng, J.Y.N. Tan, P.T.H. Low, Microelectron. Reliab. 46, 1160 (2006).
5. Y.-S. Lai, P.-C. Yang, and C.-L. Yeh, Microelectron. Reliab. doi: 10.1016/j.microrel.2007.03.005
6. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K.N. Tu, Scripta Mater. 51, 641 (2004).
7. K. Newman, Proceedings of the 55th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2005), p. 1194.
8. J.Y.H. Chia, B. Cotterell, T.C. Chai, Mater. Sci. Eng.: A 417, 259 (2006).
9. Y.-S. Lai, C.-L. Yeh, H.-C. Chang, and C.-L. Kao, J. Alloy. Comp. doi: 10.1016/j.jallcom.2006.10.102
10. Y.-S. Lai, H.-C. Chang and C.-L. Yeh, Microelectron. Reliab. 47, 2179 (2007)
11. C.-L. Yeh, Y.-S. Lai, J. Electron. Packag. 129, 98 (2007).
12. C.-L. Yeh, Y.-S. Lai, P.-F. Yang, Proceedings of the 9th IMAPS Topical Workshop on Flip Chip Technologies (Washington, DC: IMAPS, 2004).
13. C.-L. Yeh, Y.-S. Lai, Microelectron. Reliab. 46, 885 (2006).
14. C.-L. Yeh, Y.-S. Lai, J. Electron. Mater. 35, 1892 (2006).
15. C.-L. Yeh, Y.-S. Lai, IEEE Trans. Electron. Packag. Manuf. 30, 84 (2007).
16. Y. Kariya, T. Hosoi, S. Terashima, M. Tanaka, M. Otsuka, J. Electron. Mater. 33, 321 (2004).
17. Y. Kariya, T. Hosoi, T. Kimura, S. Terashima, M. Tanaka, T. Suga, Proceedings of the 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Piscataway, NJ: IEEE, 2004), p. 103.
18. C.-M. Chuang, K.-L. Lin, J. Electron. Mater. 32, 1426 (2003).
19. K. Habu, N. Takeda, H. Watanabe, H. Ooki, J. Abe, T. Saito, Y. Taniguchi, K. Takayama, Proceedings of EcoDesign: 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing (Piscataway, NJ: IEEE, 1999), p. 606.
20. J.W. Lee Z.H. Lee H.M. Lee, Mater. Trans. 46, 2344 (2005).
21. J.-M. Song, C.-F. Huang, H.-Y. Chuang, J. Electron. Mater. 35, 2154 (2006).
22. C.-M. Chuang, P.-C. Shih, K.-L. Lin, J. Electron. Mater. 33, 1 (2004).