Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1267-1272

  Berthou, M ^a,b,c   Retailleau, P ^a   Fremont H ^b   Guedon Gracia A ^b   Jephos Davennel C ^c  

^a MBDA FRANCE   (France)

^b UNIVERSITÉ DE BORDEAUX   (France)

^c CELAR   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED THERMAL CYCLES; ASSEMBLED CHIPS; FAILURE MECHANISM; IMMERSION SN; LEAD-FREE; LEAD-FREE SOLDER JOINT; MICROSTRUCTURAL CHANGES; MICROSTRUCTURE EVOLUTIONS; SAC-SOLDERS; THERMAL STORAGE; THERMOMECHANICAL FATIGUE;

BRAZING; HEAT STORAGE; INTERMETALLICS; MICROSTRUCTURE; SOLDERED JOINTS; THERMAL CYCLING; TIN; WELDING;

LEAD;

EID: 69249213945     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.07.040     Document Type: Article

References (12)

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