Determination of the eutectic structure in the Ag-Cu-Sn system

Journal of Electronic Materials

Volumn 31, Issue 2, 2002, Pages 161-167

  Lewis, Daniel ^a   Allen, Sarah ^b   Notis, Michael ^a   Scotch, Adam ^a  

^a Lehigh University   (United States)

^b UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

Eutectic; Lead free solder alloy; Microstructure; Silver copper tin

Indexed keywords

COPPER ALLOYS; EUTECTICS; GOLD ALLOYS; GROWTH (MATERIALS); MICROANALYSIS; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS;

DEEP ETCHING; ELECTRON PROBE MICROANALYSIS; EUTECTIC STRUCTURE; LEAD FREE SOLDER ALLOYS;

SOLDERING ALLOYS;

EID: 0036475941     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0163-y     Document Type: Article

References (13)

1. Pb-free Sn-Ag-Cu ternary eutectic solder