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Volumn 468, Issue 1-2, 2009, Pages 553-557
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The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating
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Author keywords
Intermetallic compound; Microstructure; Ni P CNTs composite coating; P rich layer; Shearing force
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Indexed keywords
BRAZING;
BRITTLE FRACTURE;
BRITTLENESS;
CARBON NANOTUBES;
COATINGS;
COPPER;
ELECTRONICS PACKAGING;
FRACTURE MECHANICS;
INTERMETALLICS;
MICROSTRUCTURE;
NANOCOMPOSITES;
NANOTUBES;
NICKEL;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTING INTERMETALLICS;
SHEAR STRENGTH;
SHEARING;
SILVER;
SOLDERING ALLOYS;
TIN;
WELDING;
BALL GRIDS;
CARBON NANOTUBES COMPOSITES;
ELECTROLESS;
ELECTROLESS NI;
ELECTRONIC PACKAGING;
HIGH STABILITIES;
INTERMETALLIC COMPOUND;
MECHANICAL BEHAVIORS;
METAL MATRIXES;
MULTIPLE REFLOWS;
NI-P COATINGS;
NI-P-CNTS COMPOSITE COATING;
P-RICH LAYER;
SCANNING ELECTRON MICROSCOPES;
SHEARING BEHAVIORS;
SHEARING FORCE;
SHEARING TESTS;
SOLDER JOINTS;
COMPOSITE COATINGS;
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EID: 58049200459
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.01.080 Document Type: Article |
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Times cited : (10)
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References (13)
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