Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free solders

Materials and Design

Volumn 28, Issue 3, 2007, Pages 1006-1011

  Chellaih, Titus ^a   Kumar, Girish ^a   Prabhu, K Narayan ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; METALLOGRAPHIC MICROSTRUCTURE; SOLIDIFICATION; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

SOFTWARE PACKAGE SOLIDCAST; SPHERICAL DROPLETS; THERMAL CONTACT HEAT TRANSFER;

SOLDERING ALLOYS;

COMPUTER SIMULATION; COOLING; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS; SOLIDIFICATION; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

EID: 33751423879     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2005.11.011     Document Type: Article

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