Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 979-984

  Han, Y D ^a   Tan, C M ^b,c   Nai, S M L ^c   Xu, L Y ^a   Jing, H Y ^a   Wei, J ^c  

^a TIANJIN UNIVERSITY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; COMPOSITE TECHNOLOGY; CREEP BEHAVIORS; ELECTRONIC SOLDERS; INTERCONNECT MATERIALS; MATRIX; MECHANICAL PERFORMANCE; MICRO-STRUCTURAL; MICROELECTRONICS ASSEMBLY; MICROSTRUCTURE AND PROPERTIES; NANOCOMPOSITE SOLDER; NANOMECHANICAL PROPERTY; PACKAGING INDUSTRY; SN-AG-CU; SNAGCU SOLDER; SOLDER ALLOYS; ULTIMATE TENSILE STRENGTH; WEIGHT PERCENTAGES; YIELD STRENGTH;

CARBON NANOTUBES; COATED MATERIALS; LEAD; MECHANICAL PROPERTIES; MICROELECTRONICS; PACKAGING MATERIALS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS;

TIN;

EID: 77955180809     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490658     Document Type: Conference Paper

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