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Volumn 509, Issue 33, 2011, Pages 8441-8448

Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

(1) Tsao, L C a

a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Composite solder; Isothermal aging

Indexed keywords

ACTIVATION ENERGY; COPPER ALLOYS; COPPER COMPOUNDS; INTERMETALLICS; ISOTHERMS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; TITANIUM DIOXIDE;

APPARENT ACTIVATION ENERGY; COMPOSITE SOLDERS; INTERMETALLIC GROWTH; ISOTHERMAL AGING; LEAD-FREE SOLDER ALLOY; SOLDER ALLOYS; SOLID-STATE ISOTHERMAL AGING; SUPPRESSING EFFECTS;

TIN;

EID: 79960845762 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.05.116 Document Type: Article

Times cited : (127)

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