SCOPUS 정보 검색 플랫폼

Volumn 47, Issue 9, 2012, Pages 4012-4018

Suppressing the growth of interfacial Cu-Sn intermetallic compounds in the Sn-3.0Ag-0.5Cu-0.1Ni/Cu-15Zn solder joint during thermal aging

(3) Chen, Wei Yu a Yu, Chi Yang a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; CU-SN INTERMETALLICS; EFFECTIVE SUPPRESSION; ELEMENTAL REDISTRIBUTION; INTERFACIAL INTERMETALLICS; INTERFACIAL PHASE; JOINT INTERFACES; RAPID GROWTH; SN-3.0AG-0.5CU; SOLDER JOINTS;

INTERMETALLICS; SILVER; SOLDERING ALLOYS; THERMAL AGING; ZINC;

TIN;

EID: 84862777892 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-012-6254-0 Document Type: Article

Times cited : (26)

References (25)

1
- 0033747819
- 10.1016/S0927-796X(00)00010-3 10.1016/S0927-796X(00)00010-3
- M Abtew G Selvaduray 2000 Mater Sci Eng R 27 95 141 10.1016/S0927- 796X(00)00010-3 10.1016/S0927-796X(00)00010-3
- (2000) Mater Sci Eng R , vol.27 , pp. 95-141
- Abtew, M.¹ Selvaduray, G.²

2
- 0035359656
- 10.1007/s11837-001-0099-3 10.1007/s11837-001-0099-3 1:CAS:528: DC%2BD3MXkvFehtL8%3D
- DR Frear JW Jang JK Lin C Zhang 2001 JOM 53 28 33 10.1007/s11837-001- 0099-3 10.1007/s11837-001-0099-3 1:CAS:528:DC%2BD3MXkvFehtL8%3D
- (2001) JOM , vol.53 , pp. 28-33
- Frear, D.R.¹ Jang, J.W.² Lin, J.K.³ Zhang, C.⁴

3
- 20344388336
- 10.1016/j.mser.2005.03.001 10.1016/j.mser.2005.03.001
- T Laurila V Vuorinen JK Kivilahti 2005 Mater Sci Eng R 49 1 60 10.1016/j.mser.2005.03.001 10.1016/j.mser.2005.03.001
- (2005) Mater Sci Eng R , vol.49 , pp. 1-60
- Laurila, T.¹ Vuorinen, V.² Kivilahti, J.K.³

4
- 3142539017
- 10.1143/JJAP.43.2264 10.1143/JJAP.43.2264 1:CAS:528:DC%2BD2cXktlOmsr4%3D
- K Tanida M Umemoto N Tanaka Y Tomita K Takahashi 2004 Jpn J Appl Phys 43 2264 2270 10.1143/JJAP.43.2264 10.1143/JJAP.43.2264 1:CAS:528: DC%2BD2cXktlOmsr4%3D
- (2004) Jpn J Appl Phys , vol.43 , pp. 2264-2270
- Tanida, K.¹ Umemoto, M.² Tanaka, N.³ Tomita, Y.⁴ Takahashi, K.⁵

5
- 34547375250
- Sakuma K, Andry PS, Dang B, Maria J, Tsang C, Patel C, Wright SL, Webb B, Sprogis E, Kang SK, Polastre R, Horton R, Knickerbocker JU (2007) In: Proceeding of 57th electronic components of technology conference, IEEE Components, Packaging, and Manufacturing Technology, Reno, pp 627-632
- (2007) Proceeding of 57th Electronic Components of Technology Conference, IEEE Components, Packaging, and Manufacturing Technology, Reno , pp. 627-632
- Sakuma, K.¹ Andry, P.S.² Dang, B.³ Maria, J.⁴ Tsang, C.⁵ Patel, C.⁶ Wright, S.L.⁷ Webb, B.⁸ Sprogis, E.⁹ Kang, S.K.¹⁰ Polastre, R.¹¹ Horton, R.¹² Knickerbocker, J.U.¹³

6
- 13944265579
- 10.1007/s11661-005-0138-8 10.1007/s11661-005-0138-8
- X Deng RS Sidhu P Johnson N Chaela 2005 Metall Mater Trans A 36 55 64 10.1007/s11661-005-0138-8 10.1007/s11661-005-0138-8
- (2005) Metall Mater Trans A , vol.36 , pp. 55-64
- Deng, X.¹ Sidhu, R.S.² Johnson, P.³ Chaela, N.⁴

7
- 34547401936
- 10.1007/s11664-006-0062-8 10.1007/s11664-006-0062-8
- DM Eduardo Franco P Weiqun 2007 J Electron Mater 36 783 797 10.1007/s11664-006-0062-8 10.1007/s11664-006-0062-8
- (2007) J Electron Mater , vol.36 , pp. 783-797
- Eduardo Franco, D.M.¹ Weiqun, P.²

8
- 51349150879
- Che FX, Luan JE, Baraton X (2008) In: Proceeding of 58th electronic components of technology conference, IEEE Components, Packaging, and Manufacturing Technology, Florida, pp 485-490
- (2008) Proceeding of 58th Electronic Components of Technology Conference, IEEE Components, Packaging, and Manufacturing Technology, Florida , pp. 485-490
- Che, F.X.¹ Luan, J.E.² Baraton, X.³

9
- 70450002741
- Wang YW, Kao CR (2009) Development of lead-free solders with superior drop test reliability performance. International conference on electronic packaging technology & high density packaging (ICEPT-HDP 2009), Beijing, pp 458-463
- (2009) Development of Lead-free Solders with Superior Drop Test Reliability Performance. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), Beijing , pp. 458-463
- Wang, Y.W.¹ Kao, C.R.²

10
- 51349145336
- Zhu WH, Xu L, Pang JHL, Zhang XR, Poh E, Sun YF, Sun AYS, Wang CK, Tan HB (2008) In: Proceeding of 58th electronic components of technology conference, IEEE Components, Packaging, and Manufacturing Technology, Florida, pp 1667-1672
- (2008) Proceeding of 58th Electronic Components of Technology Conference, IEEE Components, Packaging, and Manufacturing Technology, Florida , pp. 1667-1672
- Zhu, W.H.¹ Xu, L.² Pang, J.H.L.³ Zhang, X.R.⁴ Poh, E.⁵ Sun, Y.F.⁶ Sun, A.Y.S.⁷ Wang, C.K.⁸ Tan, H.B.⁹

11
- 78049529699
- 10.1007/s11664-010-1372-4
- CY Yu TK Lee M Tsai KC Liu JG Duh 2010 J Electron Mater 39 2552 2554 10.1007/s11664-010-1372-4
- (2010) J Electron Mater , vol.39 , pp. 2552-2554
- Yu, C.Y.¹ Lee, T.K.² Tsai, M.³ Liu, K.C.⁴ Duh, J.G.⁵

12
- 69949165023
- 10.1016/j.actamat.2009.06.060 10.1016/j.actamat.2009.06.060 1:CAS:528:DC%2BD1MXhtFWlu7nI
- JY Kim J Yu SH Kim 2009 Acta Mater 57 5001 5012 10.1016/j.actamat.2009. 06.060 10.1016/j.actamat.2009.06.060 1:CAS:528:DC%2BD1MXhtFWlu7nI
- (2009) Acta Mater , vol.57 , pp. 5001-5012
- Kim, J.Y.¹ Yu, J.² Kim, S.H.³

13
- 3242806751
- 10.1007/s11837-004-0108-4 10.1007/s11837-004-0108-4 1:CAS:528: DC%2BD2cXltlGit7g%3D
- SK Kang DY Shih D Leonard DW Henderson T Gosselin S Cho J Yu WK Choi 2004 JOM 56 34 38 10.1007/s11837-004-0108-4 10.1007/s11837-004-0108-4 1:CAS:528:DC%2BD2cXltlGit7g%3D
- (2004) JOM , vol.56 , pp. 34-38
- Kang, S.K.¹ Shih, D.Y.² Leonard, D.³ Henderson, D.W.⁴ Gosselin, T.⁵ Cho, S.⁶ Yu, J.⁷ Choi, W.K.⁸

14
- 34547106589
- 10.1557/jmr.2007.0234 10.1557/jmr.2007.0234 1:CAS:528: DC%2BD2sXnvVajtrY%3D
- YK Jee YH Ko J Yu 2007 J Mater Res 22 1879 1887 10.1557/jmr.2007.0234 10.1557/jmr.2007.0234 1:CAS:528:DC%2BD2sXnvVajtrY%3D
- (2007) J Mater Res , vol.22 , pp. 1879-1887
- Jee, Y.K.¹ Ko, Y.H.² Yu, J.³

15
- 51249170022
- 10.1007/BF02653349 10.1007/BF02653349 1:CAS:528:DyaK2cXltFGjsb4%3D
- M McCormack S Jin 1994 J Electron Mater 23 635 640 10.1007/BF02653349 10.1007/BF02653349 1:CAS:528:DyaK2cXltFGjsb4%3D
- (1994) J Electron Mater , vol.23 , pp. 635-640
- McCormack, M.¹ Jin, S.²

16
- 33847338562
- 10.1016/j.matchar.2006.05.013 10.1016/j.matchar.2006.05.013 1:CAS:528:DC%2BD2sXis1Cku7k%3D
- A Fawzy 2007 Mater Character 58 323 331 10.1016/j.matchar.2006.05.013 10.1016/j.matchar.2006.05.013 1:CAS:528:DC%2BD2sXis1Cku7k%3D
- (2007) Mater Character , vol.58 , pp. 323-331
- Fawzy, A.¹

17
- 77951257605
- 10.1007/s11664-009-0992-z 10.1007/s11664-009-0992-z 1:CAS:528: DC%2BC3cXnvFaltQ%3D%3D
- CY Yu KJ Wang JG Duh 2010 J Electron Mater 39 230 237 10.1007/s11664-009-0992-z 10.1007/s11664-009-0992-z 1:CAS:528: DC%2BC3cXnvFaltQ%3D%3D
- (2010) J Electron Mater , vol.39 , pp. 230-237
- Yu, C.Y.¹ Wang, K.J.² Duh, J.G.³

18
- 35248860213
- 10.1007/s11664-007-0254-x 10.1007/s11664-007-0254-x 1:CAS:528: DC%2BD2sXht1Cku7vM
- MG Cho SK Kang D Shih HM Lee 2007 J Electron Mater 36 1501 1509 10.1007/s11664-007-0254-x 10.1007/s11664-007-0254-x 1:CAS:528:DC%2BD2sXht1Cku7vM
- (2007) J Electron Mater , vol.36 , pp. 1501-1509
- Cho, M.G.¹ Kang, S.K.² Shih, D.³ Lee, H.M.⁴

19
- 0041154484
- 10.1016/S1359-6462(97)00129-2 10.1016/S1359-6462(97)00129-2 1:CAS:528:DyaK2sXkvFOgtrk%3D
- A Hayashi CR Kao YA Chang 1997 Scripta Mater 37 393 398 10.1016/S1359-6462(97)00129-2 10.1016/S1359-6462(97)00129-2 1:CAS:528: DyaK2sXkvFOgtrk%3D
- (1997) Scripta Mater , vol.37 , pp. 393-398
- Hayashi, A.¹ Kao, C.R.² Chang, Y.A.³

20
- 33744825178
- 10.1016/j.scriptamat.2006.04.027 10.1016/j.scriptamat.2006.04.027 1:CAS:528:DC%2BD28XlsFGiu7w%3D
- S Wang CY Liu 2006 Scripta Mater 55 347 350 10.1016/j.scriptamat.2006.04. 027 10.1016/j.scriptamat.2006.04.027 1:CAS:528:DC%2BD28XlsFGiu7w%3D
- (2006) Scripta Mater , vol.55 , pp. 347-350
- Wang, S.¹ Liu, C.Y.²

21
- 33845752967
- 10.1007/s11664-006-0299-2 10.1007/s11664-006-0299-2 1:CAS:528: DC%2BD28XhtlSju73O
- SJ Wang CY Liu 2006 J Electron Mater 35 1955 1960 10.1007/s11664-006- 0299-2 10.1007/s11664-006-0299-2 1:CAS:528:DC%2BD28XhtlSju73O
- (2006) J Electron Mater , vol.35 , pp. 1955-1960
- Wang, S.J.¹ Liu, C.Y.²

22
- 80052788841
- 10.1016/j.scriptamat.2011.07.029 10.1016/j.scriptamat.2011.07.029 1:CAS:528:DC%2BC3MXhtFOmu7bE
- CY Yu JG Duh 2011 Scripta Mater 65 783 786 10.1016/j.scriptamat.2011.07. 029 10.1016/j.scriptamat.2011.07.029 1:CAS:528:DC%2BC3MXhtFOmu7bE
- (2011) Scripta Mater , vol.65 , pp. 783-786
- Yu, C.Y.¹ Duh, J.G.²

23
- 78049500125
- 10.1007/s11664-010-1379-x 10.1007/s11664-010-1379-x 1:CAS:528: DC%2BC3cXhtlaksrnM
- YM Kim HR Roh S Kim YH Kim 2010 J Electron Mater 39 2504 2512 10.1007/s11664-010-1379-x 10.1007/s11664-010-1379-x 1:CAS:528:DC%2BC3cXhtlaksrnM
- (2010) J Electron Mater , vol.39 , pp. 2504-2512
- Kim, Y.M.¹ Roh, H.R.² Kim, S.³ Kim, Y.H.⁴

24
- 78650989804
- 10.3365/eml.2010.12.151 10.3365/eml.2010.12.151 1:CAS:528: DC%2BC3MXnt1OhtL0%3D
- YM Kim KM Harr YH Kim 2010 Electron Mater Lett 6 151 154 10.3365/eml.2010.12.151 10.3365/eml.2010.12.151 1:CAS:528:DC%2BC3MXnt1OhtL0%3D
- (2010) Electron Mater Lett , vol.6 , pp. 151-154
- Kim, Y.M.¹ Harr, K.M.² Kim, Y.H.³

25
- 78049516788
- 10.1007/s11664-010-1313-2 10.1007/s11664-010-1313-2 1:CAS:528: DC%2BC3cXhtlaksrvE
- J Chang S Seo HM Lee 2010 J Electron Mater 39 2643 2652 10.1007/s11664-010-1313-2 10.1007/s11664-010-1313-2 1:CAS:528:DC%2BC3cXhtlaksrvE
- (2010) J Electron Mater , vol.39 , pp. 2643-2652
- Chang, J.¹ Seo, S.² Lee, H.M.³

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