Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5715, Issue , 2005, Pages 69-79

  Bakke, Thor ^a   Friedrichs, Martin ^a   Völker, Benjamin ^a   Reiche, Manfred ^b   Leonardsson, Lars ^c   Schenk, Harald ^a   Lakner, Hubert ^a  

^a FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

^b MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^c Micronic Laser Systems AB   (Sweden)

Author keywords

Micromirrors; Optical MEMS; Spatial light modulator; Wafer bonding

Indexed keywords

ELECTRIC POTENTIAL; LIGHT MODULATION; LIGHT MODULATORS; MIRRORS; PHOTOLITHOGRAPHY; SILICON WAFERS;

MICROMIRRORS; OPTICAL MEMS; PLANARIZATION; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 21844433256     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.590567     Document Type: Conference Paper

References (15)

1. Texas Instruments Technical Journal, vol. 15, no. 3, July-September 1998
2. Jahja I. Trisnadi, Clinton B. Carlisle and Robert Monteverde, "Overview and applications of Grating Light Valve™ based optical write engines for high-speed digital imaging", Proceedings of SPIE, vol. 5348, pp. 52-64 (2004)
3. A. Gehner, M. Wildenhain, W. Doleschal, A. Elgner, H. Schenk, H. Lakner, "Improved vision by eye aberration correction using an active-matrix- addressed micromirror array", Proceedings of SPIE vol. 4985, pp. 180-192 (2003).
4. Ulrike Dauderstädt, Peter Dürr, Tord Karlin, Harald Schenk, Hubert Lakner, "Application of Spatial Light Modulators for Microlithography", Proceedings of SPIE, vol. 5348, pp. 119-126 (2004)
5. S. K. Sampath, L. St.Clai, Xingtao Wu, D. V. Ivanov, Q. Wang, C. Ghosh and K. R. Farmer, "Rapid MEMS Prototyping using SU-8, Wafer Bonding and Deep Reactive Ion Etching", Microelectr. Symposium 2001, pp. 158-161
6. F. Niklaus, S. Haasl and G. Stemme "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding,", Journal of Microelectromechanical Systems, vol. 12, no. 4, Aug. 2003, pp. 465-469
7. A. Berthold, B. Jakoby, M. J. Vellekoop, "Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures", Sensors and Actuators A, vol 68, 1998, pp. 410-413
8. S. M. L. Nai, J. Wei, P. C. Lim, C. K. Wong, "Silicon-to-Silicon wafer bonding using gold as intermediate layer", 2003 Electronics Packaging Technology Conference 2003, pp. 119-124
9. Q.-Y. Tong and U. Gösele, "Semiconductor wafer bonding", Wiley 1999
10. M. Wiegand, M. Reiche, U. Gosele, K. Gutjahr, D. Stolze, R. Longwitz, E. Hiller, "Wafer bonding of silicon wafer covered with various surface layers", Sensors and Actuators A, vol. 86, no. 1-2, 2000, pp. 91-95
11. T. Glinsner, T. Luxbacher, P. Lindner, C. Schaefer, R. Michaels, J. Palensky, V. Dragoi, and M. Reiche, "Reversible and permanent wafer bonding for GaAs processing", GaAs MANTECH, 2001, pp. 192-195
12. V. Dragoi, M. Alexe, M. Reiche, I. Radu, E. Thallner, C. Schaefer, and P. Lindner, "Si/GaAs heterostructures fabricated by direct wafer bonding", Mat. Res. Soc. Symp. Proc. Vol. 681E, pp. 15.3.1-15.3.6 (2001)
13. L. Leonardsson, "Bonding Method", International Patent No. WO 03/025986 A1
14. A. Witvrouw, B. Du Bois, P. De Moor, A. Verbist, C. Van Hoof, H. Bender, K.Baert, "A comparison between wet HF etching and vapor HF etching for sacrificial oxide removal", Proceedings of SPIE, vol. 4174, pp.125-136, (2000)
15. Gerard Klaasse, Bob Puers, and Harrie A.C. Tilmans, "Piezoelectric actuation for application in RF-MEMS switches", Proceedings of SPIE vol. 5455, pp.174-180 (2004)